Light emitting device

Abstract

A light emitting device is proposed, which emits light while connected to the power. The light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof; and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection. The light emitting device of the present invention has advantages of short current path, low series thermal resistance and low cost. In addition, the depth of the recess can further be increased to improve light collecting efficiency.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to light emitting devices and, more particularly, to a light emitting device that can be applied to high power light emitting diodes. [0003] 2. Description of Related Art [0004] Currently, light emitting diodes (LEDs) that are characterized by long lifetime, small volume, low heat dissipation, low power consumption, fast response speed and single color light emission are widely used in indicator lights, bill boards, traffic lights, auto lamps, display panels, communication tools, consumer electronics and so on. Accordingly, different packaging techniques are developed for LEDs packaging, which results in different package structures of LEDs. [0005] FIGS. 1(A) to 1(C) show a flip chip packaging process. As shown in FIG. 1(A), a plurality of conductive bumps 11 is formed on an aluminum substrate 10. Then, as shown in FIG. 1(B), an LED chip 12 is attached to the aluminum substrate 10 upsid...

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