This utility model relates to the field of circuit equipment technology and discloses a
busbar copper bus structure for improving parasitic
inductance. It includes an improved
busbar copper bus and a non-improved
busbar copper bus. The improved busbar copper bus has a copper busbar substrate in the middle, a bent portion fixedly connected to the top of the substrate, a connecting portion fixedly connected to the top of the bent portion, and wiring extension plates fixedly connected to the lower sides of both sides of the substrate. A bent plate is fixedly connected to the other end of each wiring extension plate, and a wiring plate is fixedly connected to the other end of each bent plate. This busbar copper bus structure for improving parasitic
inductance has a
short distance of 17.5mm from the positive terminal of the positive busbar copper bus to the positive
capacitor terminal, resulting in a shorter current path and better overall performance. It achieves the following technical effects: 1. Reduced parasitic
inductance; 2. Improved dynamic response; 3. Optimized
current sharing and thermal performance; 4. Suppression of
electromagnetic interference (EMI); 5. Maximized
capacitor efficiency.