Processing apparatus

a processing apparatus and processing technology, applied in the field of processing apparatuses, can solve the problem that it is difficult to reduce the influence degree of particles on wafers sufficiently, and achieve the effect of preventing object pollution

Inactive Publication Date: 2007-05-17
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0015] This invention has been made based on the above consideration, and an object of the invention is to provide a processing apparatus for processing an object to be processed contained in a hermitic container, wherein it is possible to reduce as far as possible an adverse effect of a particle in an outside space

Problems solved by technology

However, even though the techniques as described above are used, it is actually still difficult to sufficiently reduce an influence degree of particles upon wafers, when a space in an outside s

Method used

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Embodiment Construction

[0034] In a processing apparatus of the present invention, a hermetic container containing an object to be processed is placed at a predetermined position, and then the object to be processed is taken out from the container, and conveyed into an inside space area, which is maintained under a clean atmosphere, to be subjected to a predetermined process.

[0035] A carrier 10 including a main carrier body 11 is used, for example, as a container containing the object to be processed, as shown in FIG. 1. A taking-out port 11A is opened at one surface of the main carrier body 11. The taking-out port 11A is closed by a lid 12 that is provided to be removable. The carrier 10 is, for example, made of resin. The object to be processed is, for example, a wafer W whose diameter is 300 mm. The carrier 10 is composed so as to be capable of holding a plurality of, for example, 25 wafers W in a tier-like manner.

[0036] The lid 12 of the carrier 10 includes a not-shown latch mechanism (a lock mechani...

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Abstract

The present invention is a processing apparatus for an object to be processed, the processing apparatus including: a partition that defines an outside space area in which a container hermetically containing an object to be processed and having a lid is conveyed, and an inside space area in which the object to be processed taken out from the container is conveyed; an opening part provided in the partition, through which the two space areas are communicated with each other; a door mechanism that can close the opening part; a lid opening-and-closing mechanism provided at the door mechanism, and capable of opening and closing the lid of the container located at a predetermined position in the outside space area under a situation wherein the door mechanism closes the opening part; a driving unit that moves the lid opening-and-closing mechanism away from the container relatively to the door mechanism; a cover member that defines a driving-unit arrangement room, in which the driving unit is contained, in the door mechanism; and a gas-discharging mechanism that discharges a gas in the driving-unit arrangement room.

Description

TECHNICAL FIELD [0001] The present invention relates to a processing apparatus that takes out an object to be processed from a hermetic container and conducts a predetermined process to the object to be processed. BACKGROUND ART [0002] As one of semiconductor manufacturing apparatuses, for example, there is a thermal processing apparatus that conducts a heat treatment to a plurality of semiconductor wafers (hereafter, to be simply referred to as “wafer”) in a batch. This thermal processing apparatus is provided with a conveying in-and-out area where a carrier that is a container containing a plurality of wafers is conveyed in and out by an automatic conveying robot or by an operator, and a loading area where the wafers in the container are transferred and placed onto a wafer boat that is a substrate holder and are conveyed in and out from a heat treating furnace. [0003] In this thermal processing apparatus, an atmosphere in the loading area is kept cleaner than an atmosphere in the ...

Claims

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Application Information

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IPC IPC(8): B65B69/00B65G49/07H01L21/677B65G49/00
CPCH01L21/67772H01L21/68
Inventor OYAMA, KATSUHIKOMOCHIDUKI, SHINYATAKEUCHI, YASUSHI
Owner TOKYO ELECTRON LTD
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