Semiconductor wafer handling and transport

Abstract

Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

Description

RELATED APPLICATIONS [0001] This application is a continuation-in-part of U.S. application Ser. No. 10 / 985,834 filed on Nov. 10, 2004 which claims the benefit of U.S. Prov. App. No. 60 / 518,823 filed on Nov. 10, 2003 and U.S. Prov. App. No. 60 / 607,649 filed on Sep. 7, 2004. [0002] This application claims the benefit of U.S. Prov. App. No. 60 / 777,443 filed on Feb. 27, 2006; U.S. Prov. App. No. 60 / 779,684 filed on Mar. 5, 2006; U.S. Prov. App. No. 60 / 779,707 filed on Mar. 5, 2006; U.S. Prov. App. No. 60 / 779,478 filed on Mar. 5, 2006; U.S. Prov. App. No. 60 / 779,463 filed on Mar. 5, 2006; U.S. Prov. App. No. 60 / 779,609 filed on Mar. 5, 2006; U.S. Prov. App. No. 60 / 784,832 filed on Mar. 21, 2006; U.S. Prov. App. No. 60 / 746,163 filed on May 1, 2006; U.S. Prov. App. No. 60 / 807,189 filed on Jul. 12, 2006; and U.S. Prov. App. No. 60 / 823,454 filed on Aug. 24, 2006. [0003] The entire contents of each of the foregoing applications is incorporated herein by reference.BACKGROUND [0004] 1. Field of...

AI Technical Summary

Benefits of technology

[0010] Provided herein are methods and systems used for improved semiconductor manufacturing handling, and transport. Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

[0027] As used herein, the term “SCARA arm” refers to a robotic arm that includes one or more links and may include an end effector, where the arm, under control, can move linearly, such as to engage an object. A SCARA arm may have various numbers of links, such as 3, 4, or more. As used herein, “3-link SCARA arm” shall include a SCARA robotic arm that has three members: link one (L1), link two (L2) and an end effector. A drive for a 3-link SCARA arm usually has 3 motors: one connected to L1, one to the belt system, which in turn connects to the end effector through pulleys and a Z (lift) motor. One can connect a fourth motor to the end effector, which allows for some unusual moves not possible with only three motors.

[0036] Disclosed herein are methods and systems for supporting vacuum processing and handling modules in vacuum semiconductor processing systems. The pedestal support systems herein disclosed may precisely position vacuum modules to facilitate proper vacuum sealing between adjacent modules. In embodiments, the pedestal's cylindrical shape affords opportunity for convenient manufacturing methods while providing stability to the supported vacuum module with a small footprint.

[0037] In embodiments, the pedestal support system further may incorporate a robot motor mechanism for a robot operating within the vacuum module, further reducing the overall size and cost of the vacuum processing system.

[0038] A pedestal support system with a rolling base may also provide needed flexibility in reconfiguring processing and handling modules quickly and cost effectively.

Problems solved by technology

Cluster tools, machines that arrange a group of semiconductor processing modules in a radius about a central robotic arm, take up a large amount of space, are relatively slow, and, by virtue of their architecture, are limited to a small number of semiconductor process modules, typically a maximum of about five or six.

Linear tools, while offering much greater flexibility and the potential for greater speed than cluster tools, do not fit well with the current infrastructure of most current semiconductor fabrication facilities.

Moreover, linear motion of equipment components within the typical vacuum environment of semiconductor manufacturing leads to problems in current linear systems, such as unacceptable levels of particles that are generated by friction among components.

As semiconductor manufacturing has grown in complexity, it becomes increasingly necessary to transfer wafers among a number of different process modules or clusters of process modules, and sometimes between tools and modules that are separated by significant distances.

This poses numerous difficulties, particularly when wafers are transferred between separate vacuum processing facilities.

Transfers between vacuum environments, or between a vacuum and other processing environments often results in increased risk of particle contamination (due to the pumping and venting of wafers in load locks) as well as higher thermal budgets where wafers are either heated or cooled during transfers.

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