Precursors and hardware for CVD and ald

Inactive Publication Date: 2008-03-13
APPLIED MATERIALS INC
View PDF10 Cites 292 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009] The present invention generally comprises an apparatus for depositing high k dielectric or metal gate materials in which toxic, flammable, or pyrophoric precursors may be used. Exhaust conduits may be placed on the liquid precursor or solid precursor delivery cabinet,

Problems solved by technology

While conventional CVD has proved successful for device geometries and aspect ratios down to

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Precursors and hardware for CVD and ald
  • Precursors and hardware for CVD and ald
  • Precursors and hardware for CVD and ald

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] The present invention generally comprises an apparatus for depositing high k dielectric materials or metal gate materials in which toxic, flammable, or pyrophoric precursors may be used. Exhaust conduits may be placed on the liquid precursor or solid precursor delivery cabinet, the gas panel, and the water vapor generator area. The exhaust conduits permit a technician to access the apparatus without undue exposure to toxic, pyrophoric, or flammable gases that may collect within the liquid precursor or solid precursor delivery cabinet, gas panel, and water vapor generator area. Exemplary high k dielectric material that may be deposited include HfO2, HfSiO, Pr2O3, La2O5, ZrO2, ZrSiO, Al2O3, LaAlO, Ta2O5, TaO5, AlO5, and TiO5. Exemplary metal gate materials that may be deposited include TaN, TiN, TaSiN, Ru, Pt, TiAlN, and HfN. Other films may also be deposited including polysilicon, SiN, and HTO. The apparatus may be an ALD reactor or a CVD reactor.

[0018]FIG. 1 depicts a schema...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Flammabilityaaaaaaaaaa
Login to view more

Abstract

The present invention generally comprises an apparatus for depositing high k dielectric or metal gate materials in which toxic, flammable, or pyrophoric precursors may be used. Exhaust conduits may be placed on the liquid precursor or solid precursor delivery cabinet, the gas panel, and the water vapor generator area. The exhaust conduits permit a technician to access the apparatus without undue exposure to toxic, pyrophoric, or flammable gases that may collect within the liquid deliver cabinet, gas panel, and water vapor generator area.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application claims benefit of U.S. Provisional Patent Application Ser. No. 60 / 824,037 (APPM / 010158L), filed Aug. 30, 2006, which is herein incorporated by reference.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] Embodiments of the present invention generally relate to precursors and hardware for depositing high k dielectrics and metal gate materials using atomic layer deposition (ALD) or chemical vapor deposition (CVD). [0004] 2. Description of the Related Art [0005] In the field of semiconductor processing, flat-panel display processing or other electronic device processing, vapor deposition processes have played an important role in depositing materials on substrates. As the geometries of electronic devices continue to shrink and the density of devices continues to increase, the size and aspect ratio of the features are becoming more aggressive, e.g., feature sizes of 0.07 μm and aspect ratios of 10 or greate...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C23C16/22
CPCC23C16/34C23C16/405C23C16/4404C23C16/45582C23C16/45553C23C16/45561C23C16/45544
Inventor KHER, SHREYAS S.NGUYEN, SON T.NARWANKAR, PRAVIN K.TANDON, SANJEEVJUMPER, STEVESERMONA, VINCENT
Owner APPLIED MATERIALS INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products