Light emitting diode structure with high heat dissipation
a technology of light-emitting diodes and structures, applied in semiconductor devices, semiconductor/solid-state device details, electrical devices, etc., can solve the problems of high manufacturing cost, high manufacturing cost, and complicated manufacturing process, and achieve the effect of high heat dissipation and low manufacturing cos
Inactive Publication Date: 2008-08-14
HARVATEK CORPORATION
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Benefits of technology
[0008]In view of the foregoing shortcomings of the prior art, the inventor of the present invention based on years of experience in the related industry to conduct experiments and modifications, and finally developed a light emitting diode with a high heat dissipating effect by using simple equipment to overcome the shortcomings of the prior art and lower the manufacturing cost significantly.
Problems solved by technology
Since the brightness of a single piece of light emitting diode is very limited, several pieces of light emitting diodes are combined to produce a high-brightness light source, but such arrangement causes more complicated manufacturing processes and incurs higher costs.
When the light emitting chip in accordance with the foregoing patented technology is lit, the heat produced by the light emitting chip is dissipated from the heat sinking slug to achieve the heat dissipating effect, but this type of high-power light emitting diodes involves a complicated manufacturing process and many types of equipments, and thus the manufacture consumes much time, takes many steps, and incurs high costs.
Method used
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Embodiment Construction
[0019]The technical characteristics, features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings. The drawings are provided for reference and illustration only, but not intended for limiting the present invention.
[0020]Referring to FIG. 1 for a flow chart of a manufacturing procedure of a light emitting diode of the present invention, the manufacturing procedure of a light emitting diode with a high heat dissipation effect comprises the steps of:
[0021]Step 10: preparing a thick metal;
[0022]Step 20: shaping the thick metal into a plurality of connected lead frames by an etching technology or a punching technology;
[0023]Step 30: fixing a visible or invisible light chip onto the lead frame by an adhesive to complete a chip bonding process, wherein the adhesive is either non-conductive or conductive (such as a silver paste or a thermal paste);
[0024]Step 40: soldering ...
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A light emitting diode structure with a high heat dissipating effect includes a lead frame, a chip, two lead wires, an internal casing and an external casing. The lead frame has a first electrode and a second electrode, and the first electrode forms a cavity for installing the visible or invisible light chip in the cavity, and the chip is electrically coupled to two lead wires, and an end of the two lead wires is electrically and respectively coupled to the first and second electrodes, and the chip has an internal casing, and the two lead wires of the lead frame and the surface of the internal casing are wrapped by an external casing having a base and a lens.
Description
BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a light emitting diode, and more particular to a light emitting diode with a high heat dissipating effect.[0003]2. Description of Prior Art[0004]Traditional light emitting diode (LED) gradually replaces traditional light bulb due to its compact size, low power consumption, and long life expectancy, and thus LEDs are used extensively in the different areas such as traffic lights, signal lights, flashlights, mobile phones, lamps and large outdoor billboards. Since the brightness of a single piece of light emitting diode is very limited, several pieces of light emitting diodes are combined to produce a high-brightness light source, but such arrangement causes more complicated manufacturing processes and incurs higher costs.[0005]As a result, a high-power light emitting diode is introduced to the market, and the high-power light emitting diode can produce a super high brightness light source...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L33/00H01L23/495H01L33/62H01L33/64
CPCH01L33/62H01L33/64H01L33/647H01L2224/48091H01L2224/48247H01L2924/00014
Inventor WANG, BILYCHUANG, JONNIEHUANG, MIKO
Owner HARVATEK CORPORATION