Led chip package structure using sedimentation and method for making the same

Abstract

An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to an LED chip package structure and a method for making the same, and particularly relates to an LED chip package structure using sedimentation and a method for making the same.[0003]2. Description of Related Art[0004]Referring to FIG. 1, a known LED package structure includes a substrate 1, an LED 2 disposed on the substrate 1, two wires 3, and a colloid layer 4 with phosphor powder 40.[0005]The LED 2 has a light-emitting surface 20 opposite to the substrate 1. The LED 2 has a positive electrode area 21 and a negative electrode area 22 electrically connected to two corresponding positive and negative electrode areas 11, 12 of the substrate 1 via the two 3 respectively. Moreover, the colloid layer 4 with the phosphor powder 40 covers the LED 2 and the two wires 3 for protecting the LED 2. Therefore, when the LED 2 is a blue LED, the blue light generated by the blue LED can pass through the...

AI Technical Summary

Benefits of technology

[0007]One particular aspect of the present invention is to provide an LED chip package structure using sedimentation and a method for making the same. Because the powder of the present invention can be fully deposited on the inner surface of the package body, “the condensing capability” and “the color and luster” of the present invention are good and uniform. In other words, the powder of the present invention can be fully deposited on the inner surface of the package body, so that light generated by the light-emitting elements can pass through the uniform package colloid layer to project uniform light beams out. Hence, the present invention can generate a best light-projecting quality.

[0012]3. Third aspect: The package unit has a package colloid layer with powder and a transparent colloid layer received in the receiving space. The light-emitting element is covered by the transparent colloid layer, and the package colloid layer is disposed on the transparent colloid layer in order to prevent the quality of the package colloid layer from being affected by heat generated by the light-emitting element.

[0017]Therefore, the package colloid layer with the powder is fully deposited firstly, and then the package colloid layer with the powder is heated, in order to make the powder be fully deposited in the receiving space of the package body. Hence, the present invention can prevent non-deposited powder from be solidified in the receiving space of the package body. In addition, the curing time can be decreased, so that the usage life of the package colloid layer with the powder is increased.

[0019]1. First type is a single deposition as the first embodiment. The advantage is: the manufacture process is simple.

[0020]2. Second type is a dual-layer structure with an inner deposition as the second embodiment. The advantage is: the dual-layer structure has two colloid layers that have the same or different physical property and chemical property such as adhesiveness, hardness or refractive index etc. In addition, the optical quality and the package structure of the second type are good.

[0021]3. Third type is a dual-layer structure with an outer deposition as the third embodiment. The advantage is: the package colloid layer is disposed on the transparent colloid layer in order to prevent the quality and the usage life of the package colloid layer from being affected (decreased) by heat generated by the light-emitting element.

Problems solved by technology

However, the phosphor powder 40 does not be uniformly mixed into the colloid layer 4.

Hence, when the blue light generated by the blue LED can pass through the colloid layer 4 with the phosphor powder 40 to generate white light, “the condensing capability” and “the color and luster” of the white light are bad and non-uniform.

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