Heat dissipation device

Abstract

A heat dissipation device adapted for dissipating heat generated by a heat source is provided. The heat dissipation device includes a base and a heat dissipation fin assembly. The base is disposed on the heat source. The heat dissipation fin assembly is disposed on the base and includes a plurality of parallel fins. The heat dissipation fins assembly has opposite air inlet side and air outlet side. A turbulence generating structure is formed by at least a part of the fins or holes at the air inlet or the air outlet of the heat dissipation fin assembly.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of Taiwan application serial no. 98103668, filed on Feb. 5, 2009. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of specification.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates generally to a heat dissipation device, and more particularly to a heat dissipation device which includes heat dissipation fins designed to generate a desired heat dissipation airflow field.[0004]2. Description of Related Art[0005]In general, a motherboard inside a computer host includes a plurality of electronic components mounted thereon. A part of the electronic components such as a central processing unit (CPU), a pulse width modulator (PWM) and a north bridge generate a considerable amount of heat during operation. If the heat cannot be timely removed such that the heat is continuously accumulated on the ...

AI Technical Summary

Benefits of technology

[0008]Accordingly, the present invention is directed to a heat dissipation device which can generate a desired cooling airflow field to provide an improved performance of dissipating the heat of a heat source.

[0011]According to one embodiment of the present invention, the turbulence generating structure is formed by reducing the size of at least a part of the fins at the air outlet side.

[0017]In view of the foregoing, the turbulence generating structures can redirect the airflow flowing through the heat dissipation device, thereby cooling the heat sources below the heat dissipation device and at the air outlet side. In addition, the turbulence generating structures can increase the longitudinal turbulence intensity of the airflow at the air outlet / inlet sides and change the longitudinal press gradient of the airflow, thus improving the cooling performance of the heat dissipation device.

Problems solved by technology

A part of the electronic components such as a central processing unit (CPU), a pulse width modulator (PWM) and a north bridge generate a considerable amount of heat during operation.

If the heat cannot be timely removed such that the heat is continuously accumulated on the electronic components, the temperature of the electronic components will gradually rise and exceed their normal operating temperature.

As a result, the electronic components cannot operate stably, thereby causing a crash of the computer host.

In addition, if the temperature is unduly high, the electronic components may be damaged, thus causing a permanent failure.

However, in this heat dissipation device, the airflow generated by the fan must be guided by the airflow guide plate coupled to the heat dissipation base to dissipate the heat of the electronic components on the surface of the circuit board.

Therefore, the design of the heat dissipation device may be complicated.

Furthermore, extra components are required to assemble the heat dissipation base and the airflow guide plate, which not only increases the manufacturing cost of the heat dissipation device, but also reduces the reliability of the heat dissipation device due to the manufacturing tolerance or assembly tolerance.

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