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Flat plate type micro heat spreading device

a heat spreading device and micro-plate technology, applied in semiconductor devices, cooling/ventilation/heating modifications, basic electric elements, etc., can solve the problems of inability to efficiently spread heat, heat spreading devices have performance limits, and heat problems that may become serious, so as to prevent a backflow of vapor bubbles, reduce the probability of compression, and improve the capillary force

Inactive Publication Date: 2010-10-14
ELECTRONICS & TELECOMM RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0014]As described above, since the flat plate type heat spreading device according to an embodiment of the present invention is constructed with a multi-channel capillary structure in which edges of a cross section of grooves of upper and lower plates are sharply formed, capillary force is largely improved, thereby activating a circulation procedure of evaporation and condensation.
[0015]In addition, the flat plate type heat spreading device according to an embodiment of the present invention can prevent a back flow of vapor bubbles without another structure by using a two-step capillary structure of a lower plate and remove a probability of compression generated in a vacuum state by using bridges formed in upper, middle, and lower plates.
[0016]In addition, since the flat plate type heat spreading device can adjust a size thereof, if necessary, the flat plate type heat spreading device can be applied to various fields.

Problems solved by technology

In addition, this problem on heat is not limited to CPUs.
Typically, if performance of mobile phones that require a more highly integrated design than the PCs has been developed at a current development speed, the heat problem may become serious.
It is impossible to efficiently spread the heat only by attaching a heat sink for spreading the heat and a cooling device for transferring heat.
In case of a solid material with high thermal conductivity which is generally used as the heat spreading device has a limit in performance.
Recently, although a solid material of which heat transfer coefficient is largely improved may be used, this also has a limit in heat performance.
However, in spite of high heat performance of the heat pipes, if there is no space available for the heat pipes in a small electronic package structure, the heat pipes have to be manufactured with a small and thin shape.
In this case, although heat pipes with a circular type may be compressed and used, if the heat pipes are not initially designed with a thin shape, the heat performance is largely reduced.

Method used

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Experimental program
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first embodiment

[0024]FIG. 1 is a flat plate type heat spreading device according to the present invention.

[0025]The flat plate type heat spreading device according to the embodiment is constructed by combining an upper plate 100, a middle plate 200, and a lower plate 300 with one another so as to form a closed structure. An operating fluid is injected into the closed heat spreading device. Heat is exchanged between an evaporation part of the lower plate 300 and a condensation part of the upper plate 100 through a heat transfer method through phase transition.

[0026]Specifically, the lower plate 300 evaporates the operating fluid (hereinafter, referred to as liquid) by using heat transferred from a heat source. The evaporated vapor is transmitted to the upper plate 100 through a vapor flow path 210 formed in the middle plate 200. The evaporated vapor is condensed into liquid in the upper plate 100 and transmitted to the lower plate 300 again, so as to dissipate heat of the heat source to the outside...

second embodiment

[0037]FIG. 2 is a flat plate type heat spreading device according to the present invention.

[0038]FIG. 2 illustrates a structure constructed with the upper, middle, and lower plates 100 to 300 with one another so as to form a closed structure, like the heat spreading device of FIG. 1. The operating fluid is injected into the heat spreading device with the closed structure. As described in FIG. 1, heat is exchanged between the evaporation part of the lower plate 300 and the condensation part of the upper plate 100 through a heat transfer process based on phase transition.

[0039]However, in FIG. 2, two orthogonal bridges for preventing compression in a vacuum state are formed instead of a single bridge. That is, two orthogonal bridges are formed in the evaporation space of the lower plate 300. In the upper and middle plates 100 and 200, two orthogonal bridges are also formed at a position corresponding to the two orthogonal bridges of the lower plate 300.

third embodiment

[0040]FIG. 3 is a flat plate type heat spreading device according to the present invention.

[0041]In FIG. 3, heat of the heat source is dissipated to the outside of the upper plate through the same procedure as the procedure of FIG. 1. However, the capillary structures of the upper and lower plate 100 and 200 are constructed with unidirectional grooves and new grooves perpendicular to the unidirectional grooves instead of unidirectional grooves.

[0042]Accordingly, in the upper plate 100, two liquid collection grooves 120 for collecting the condensed liquid are further formed in a direction perpendicular to the new grooves. Accordingly, in FIG. 2, the condensed liquid is collected into the liquid collection grooves formed on both sides of the upper plate.

[0043]In addition, in the middle plate 200, the liquid flow paths 220 are additionally formed at positions corresponding to the liquid collection grooves. In the lower plate 320, upper end parts with a two-step structure are further fo...

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Abstract

A flat plate type heat spreading device is provided. The flat plat type heat spreading device can reduce heat by generating phase transition of liquid by using heat of a heat source so as to solve various problems caused by heat generated in components of electronic devices such as personal computers or mobile phones. Specifically, the flat plate type heat spreading device includes a lower plate for evaporating liquid, a middle plate combined with an upper surface of the lower plate, which separately includes a path through which evaporated vapor passes and a path through which condensed fluid flows into the lower plate, and an upper plate combined with an upper surface of the middle plate, which condenses the evaporated vapor.

Description

TECHNICAL FIELD[0001]The present invention relates to a flat plate type heat spreading device, and more particularly, to a device capable of reducing heat by inducing phase transition of liquid by using heat of a heat source so as to solve various problems caused by heat generated in components of electronic devices such as personal computers (PCs) or mobile phones.[0002]Specifically, the present invention relates to a flat plate type heat spreading device capable of evaporating operating fluid injected into a closed space by using a heat source and dissipating the heat through a procedure of condensing the evaporated vapor, again.BACKGROUND ART[0003]As the latest technique has been developed, it is impossible to ignore heat emitted by CPUs (central processing units) as performance of personal computers (PCs) has been increased and as a degree of packaging integration has been increased. In addition, this problem on heat is not limited to CPUs. This is because the latest fabrication...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28D15/04F28D15/00
CPCH01L23/427H01L2924/0002H01L2924/00H05K7/20
Inventor MOON, SEOK HWANHWANG, GUNN
Owner ELECTRONICS & TELECOMM RES INST
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