Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator

a technology composition, which is applied in the direction of epoxy resin coating, epoxy resin adhesive, lamination, etc., can solve the problems of great problems with the storage stability of heat-curing epoxy resin composition, and achieve good storage stability, rapid curing, and good effect

Inactive Publication Date: 2010-10-28
SIKA TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0006]It is an object of the present invention, therefore, to provide heat-curing epoxy resin compositions, more particularly high-impact heat-curing epoxy resin compositions, which on the one hand have good storage stability at room temperature and on the other hand exhibit rapid curing at temperatures of 170° C. to 160° C., typically at 165° C.
[0007]This object has been achieved, surprisingly, by means of a heat-curing epoxy resin composition in accordance with claim 1. This epoxy resin composition can be used to particularly good effect as a one-component heat-curing adhesive, more particularly as a heat-curing one-component bodyshell adhesive in vehicle construction, and also for producing coatings, more particularly paints, and also for producing a structural foam for the reinforcement of cavities, more particularly of metallic structures.

Problems solved by technology

Nevertheless, it has been found that the use of aromatic accelerants of this kind leads to great problems with the storage stability of the heat-curing epoxy resin compositions.

Method used

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  • Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator
  • Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator
  • Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator

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examples

[0211]Curing Agents for Epoxy Resins

N,N-Dimethylurea (=1,1-dimethylurea) (“asym DMH”)

[0212]n=1, R1═H, R2═R3═CH3

[0213]N,N-Dimethylurea was obtained from Aldrich, Switzerland.

N′,N′-Dimethyl-N-butylurea (=3-butyl-1,1-dimethylurea) (“BuDMH”)

[0214]n=1, R1=n-butyl, R2═R3═CH3

[0215]50 ml of tetrahydrofuran (THF) and 20.0 g of an approximately 33% strength solution of dimethylamine in ethanol (Fluka) (about 146 mmol of amine) were charged to a 100 ml two-neck flask with reflux condenser. Subsequently, over 30 minutes, 14.5 g of butyl isocyanate (Fluka) (about 146 mmol of NCO) were slowly added dropwise, producing a slight exothermic response. After 3 hours of stirring at ambient temperature, the solvent was stripped off on a rotary evaporator at 80° C. under vacuum. This gave about 21.0 g of a slightly yellowish, low-viscosity liquid. The desired adduct was used further without other purification.

Hexamethylenebis(1,1-dimethylurea) (=1,1′-(hexane-1,6-diyl)bis(3,3-dimethylurea) (“HDIDMH”)

[02...

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Abstract

The present invention relates to heat-curing epoxy resin compositions, which are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions.

Description

TECHNICAL FIELD[0001]The invention relates to the field of heat-curing epoxy resin compositions, more particularly of high-impact heat-curing epoxy resin compositions, more particularly for use as bodyshell adhesive and for producing structural foams.PRIOR ART[0002]Heat-curing epoxies are long-established resin compositions. For some time now attempts have been undertaken to eliminate or at least greatly reduce the great disadvantage of epoxy resin compositions, namely their brittleness, which leads to the cured epoxy resin composition, under stress, acquiring cracks or suffering destruction. This has already been tried by adding impact modifiers or through chemical modification of epoxy resins.[0003]One important field of use for heat-curing epoxy resin compositions is in vehicle construction, and more particularly in the adhesive bonding or foam filling of cavities in bodyshell construction. In both cases, after the epoxy resin composition has been applied, the body is heated in a...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C08L63/00C08L75/04C08J9/06B32B27/38B32B37/12
CPCC08G18/12C08G18/2865C09J163/00C09D163/00C08L75/04C08L63/00C08G59/686C08G18/4854C08G18/698C08G18/792C08G18/2825C08L2666/20Y10T428/31515
Inventor KRAMER, ANDREASFINTER, JURGENFRICK, KARSTENRHEINEGGER, URSSCHULENBURG, JAN OLAF
Owner SIKA TECH AG
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