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High performance heat transfer device, methods of manufacture thereof and articles comprising the same

Inactive Publication Date: 2010-11-25
GENERAL ELECTRIC CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0005]Disclosed herein is a heat transfer device comprising a shell; the shell being an enclosure that prevents matter from within the shell from being exchanged with matter outside the shell; the shell having an outer surface and an inner surface; and a porous layer disposed on the inner surface of the shell; the porous layer having a thickness effective to enclose a region between opposing faces; the region providing a passage for the transport of a fluid; the porous layer having a thermal conductivity of about 0.1 to about 2000 watts per meter-Kelvin and a mass flow rate of about 10−9 to about 10−4 kilograms pe

Problems solved by technology

When a fluid is contained in a vessel under saturation conditions, addition of heat leads to evaporation or boiling.
This trade-off can be further complicated when applications require that the transport section function under increasing gravitational forces.
This requires decreased pore sizes, which then limit the heat transfer.

Method used

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  • High performance heat transfer device, methods of manufacture thereof and articles comprising the same
  • High performance heat transfer device, methods of manufacture thereof and articles comprising the same
  • High performance heat transfer device, methods of manufacture thereof and articles comprising the same

Examples

Experimental program
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example 1

[0096]This example is conducted to demonstrate the properties of contact angle and its effect on film thickness on particles that are used to form the porous layer. The porous layer comprises particles as shown in the FIG. 3. The FIG. 3 depicts a unit cell formed by the particles. With respect to the FIG. 3, the unit cell comprises two particles 202 and 204. The particles have a diameter Dp and a contact angle “θ” that may be varied with tailored coatings.

[0097]Upon contact the fluid spreads over the particles in the porous layer to form a film. The thickness of the film depends upon the pore sizes and the contact angle of the particle with the fluid.

[0098]FIG. 4 is a graph that depicts a calculated geometric thin film area per unit cell at a contact angle of 10 degrees and a fill factor, defined to be the ratio of the liquid area to total area per unit cell, of 50%. From the FIG. 4 it can be seen that the thin film area increases rapidly as particle size decreases. As the particle ...

example 2

[0102]This example demonstrates the formation of a porous layer comprising copper particles. Copper particles having an average particle size of 50 micrometers and a unimodal particle size distribution with a polydispersity index of about 1.15. The FIG. 6 depicts the manufacturing of a porous layer that comprises copper particles. The copper particles were pre-pressurized in a die at ˜22 kilo pounds per square inch (Kpsi), and then sintered between 850 to 950° C. for 6 hours. Then the copper porous layer in an amount of ˜3 grams was then coated with ˜0.03 grams of silica. The silica was added via chemical vapor deposition, during which SiCl4 gas was passed across the surfaces of the copper particles via a nitrogen carrying gas. The SiCl4 condenses to form a SiO2 network on the particle surfaces through hydrolization. The contact angle of the SiO2 coated copper particles is less than 5 degrees after the coating. It is to be noted that the sintering to form copper layer conducted prio...

example 3

[0103]This example demonstrates the manufacturing of a porous layer that comprises silica nanoparticles. The silica nanoparticles like the copper particles in Example 2, have a unimodal particle size distribution with a polydispersity index of about 1. The silica nanoparticles have a particle size diameter of about 300 nanometers. The silica particles were dispersed in a volatile solvent, for example, isopropanol, with a concentration of up to 30 weight percent. The solution was spray coated on a silicon substrate and sintered at 900° C. for 6 hours in a vacuum oven.

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Abstract

Disclosed herein is an heat transfer device comprising a shell; the shell being an enclosure that prevents matter from within the shell from being exchanged with matter outside the shell; the shell having an outer surface and an inner surface; and a porous layer disposed on the inner surface of the shell; the porous layer having a thickness effective to enclose a region between opposing faces; the region providing a passage for the transport of a fluid; the porous layer having a thermal conductivity of about 0.1 to about 2000 watts per meter-Kelvin and a mass flow rate of about 10−9 to about 10−4 kilograms per second.

Description

STATEMENT OF FEDERAL SUPPORT[0001]The present invention was developed in part with funding from the U.S. Government Defense Advanced Projects Research Agency under Grant #N66001-08-C-2008. The United States Government has certain rights in this invention.BACKGROUND OF THE INVENTION[0002]This disclosure relates to a high performance heat transfer device, methods of manufacture thereof and to articles comprising the same.[0003]When a fluid is contained in a vessel under saturation conditions, addition of heat leads to evaporation or boiling. This evaporation causes an increase in vapor pressure, which drives the flow of vapor to the cooler areas of the system, hereby referred to as the condenser region. At the condenser region, heat is rejected as vapor condenses to a liquid. Porous media capillaries or gravity can be used to transport liquid back to the evaporation area. This mechanism of two-phase heat transfer is often employed, as it is very efficient at moving large amounts of he...

Claims

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Application Information

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IPC IPC(8): F28F7/00
CPCB22F3/1121B22F7/004F28D15/046H01L23/427F28F2245/04H01L2924/0002F28F2245/02H01L2924/00
Inventor RUSH, BRIAN MAGANNDE BOCK, HENDRIK PIETER JACOBUSDENG, TAORUSS, BORIS ALEXANDERVARANASI, KRIPA KIRANWEAVER, JR., STANTON EARL
Owner GENERAL ELECTRIC CO