High performance heat transfer device, methods of manufacture thereof and articles comprising the same
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example 1
[0096]This example is conducted to demonstrate the properties of contact angle and its effect on film thickness on particles that are used to form the porous layer. The porous layer comprises particles as shown in the FIG. 3. The FIG. 3 depicts a unit cell formed by the particles. With respect to the FIG. 3, the unit cell comprises two particles 202 and 204. The particles have a diameter Dp and a contact angle “θ” that may be varied with tailored coatings.
[0097]Upon contact the fluid spreads over the particles in the porous layer to form a film. The thickness of the film depends upon the pore sizes and the contact angle of the particle with the fluid.
[0098]FIG. 4 is a graph that depicts a calculated geometric thin film area per unit cell at a contact angle of 10 degrees and a fill factor, defined to be the ratio of the liquid area to total area per unit cell, of 50%. From the FIG. 4 it can be seen that the thin film area increases rapidly as particle size decreases. As the particle ...
example 2
[0102]This example demonstrates the formation of a porous layer comprising copper particles. Copper particles having an average particle size of 50 micrometers and a unimodal particle size distribution with a polydispersity index of about 1.15. The FIG. 6 depicts the manufacturing of a porous layer that comprises copper particles. The copper particles were pre-pressurized in a die at ˜22 kilo pounds per square inch (Kpsi), and then sintered between 850 to 950° C. for 6 hours. Then the copper porous layer in an amount of ˜3 grams was then coated with ˜0.03 grams of silica. The silica was added via chemical vapor deposition, during which SiCl4 gas was passed across the surfaces of the copper particles via a nitrogen carrying gas. The SiCl4 condenses to form a SiO2 network on the particle surfaces through hydrolization. The contact angle of the SiO2 coated copper particles is less than 5 degrees after the coating. It is to be noted that the sintering to form copper layer conducted prio...
example 3
[0103]This example demonstrates the manufacturing of a porous layer that comprises silica nanoparticles. The silica nanoparticles like the copper particles in Example 2, have a unimodal particle size distribution with a polydispersity index of about 1. The silica nanoparticles have a particle size diameter of about 300 nanometers. The silica particles were dispersed in a volatile solvent, for example, isopropanol, with a concentration of up to 30 weight percent. The solution was spray coated on a silicon substrate and sintered at 900° C. for 6 hours in a vacuum oven.
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