Microelectronics cooling system

a cooling system and microelectronic technology, applied in the field of microelectronic cooling systems, can solve the problems of mechanical complexity and energy-intensive systems, microelectronic devices can generate significant amounts of heat in the course of their operation, and damage electronic components,

Inactive Publication Date: 2010-12-30
QCIP HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0015]In another general aspect, the invention features a microelectronics cooling system that includes means for absorbing heat from a microelectronic device in a microelectronic device enclosure through evaporation of a working fluid by a plurality of microchannels that are proximate the microelectronic device within the enclosure and having a cross-sectional dimension to the center of the channel that is about equal to or less than the...

Problems solved by technology

Microelectronic devices can generate significant amounts of heat in the course of their operation.
The generated heat needs to be removed and dissipated, to prevent a catastrophic rise in operating temperature, which can impair the proper functioning of the devices, or even damage the electronic components.
Often, such secondary means of cooling are mechanically complex and energy-int...

Method used

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Examples

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example 1

Air-cooled Single-Tube Non-Wick Heat Pipe System

[0061]A heat pipe system is constructed, consisting of a microchannel block-type heat absorber, a finned microchannel heat sink, a connecting pipe, and a working fluid. The heat absorber is an Atotech “Ardex MC-1” microchannel CPU cooler, manufactured by Atotech Deutschland GmbH of Berlin, Germany. One of the two threaded ports is provided with a male adapter ⅜″ tube fitting. The other threaded port is closed off with a pipe plug. The heat sink is an Atotech “Ardex MC-1” microchannel CPU cooler, modified by the addition of thin sheet metal copper cooling fins soldered to the flat side of the MC-1 device. One of the two threaded ports is provided with a male adapter ⅜″ tube fitting. The other threaded port is closed off with a pipe plug. The connecting pipe is a ⅜″ diameter semi-flexible copper or perfluoroalkoxy (PFA) plastic tube, connected to the absorber and heat sink by means of the tube fittings. The connecting pipe is preferably ...

example 2

Air-Cooled Two-Tube Non-Wick Heat Pipe System

[0067]A heat pipe system was constructed, consisting of an Atotech Ardex P microchannel block-type heat absorber, a finned microchannel heat sink, two connecting pipes, and a working fluid. The microchannel heat sink consisted of an Atotech Ardex P microchannel block soldered to a CompUSA Pentium 4 Socket 478 CPU cooler fin-fan assembly. The heat pipe assembly consisted of substantially the same equipment and construction as used in Example 1, with the following differences. The second port of the heat absorber was provided with a ¼″ tube fitting male run tee, in lieu of the pipe plug. The second port of the heat sink was provided with a male adapter ¼″ tube fitting, in lieu of the pipe plug. Two connecting pipes were used. The vapor pipe was a ⅜″ diameter PFA tube, and the liquid pipe was a ¼″ PFA tube. The connecting tubes were connected to the absorber by means of the tube fittings on the heat absorber and the heat sink. The working fl...

example 3

Liquid-Cooled Single-Tube Heat Pipe System

[0071]A heat pipe system is constructed, consisting of a microchannel block-type heat absorber, a water-cooled microchannel heat exchanger heat sink, a connecting pipe, and a working fluid. The heat pipe assembly consists of substantially the same equipment as described in Example 2, with the following differences. The heat sink is a cross-flow 2-fluid microchannel heat exchanger. The working fluid is the first fluid, and flowing cooling water is the second fluid, so that heat is removed from the system by heat transfer from the condensing working fluid vapors, through the walls of the microchannel heat sink, into the cooling water.

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PUM

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Abstract

In one general aspect, a microelectronics cooling device can include a microchannel heat exchanger within an enclosure that houses the device at a heat absorbing end and another heat exchanger which is optionally also a microchannel heat exchanger at a heat sink end outside the enclosure. One or more pipes flowably connect the two ends for transporting liquid working fluid to the heat absorber and vaporized working fluid to the heat sink. The heat pipes may also be used to transfer heat outside a room that contains the electronic devices.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit under 35 U.S.C. 119(e) of U.S. provisional application Ser. No. 61 / 017,198 filed Dec. 28, 2007, is a continuation-in-part of U.S. Ser. No. 12 / 291,544 filed Nov. 10, 2008, and is a continuation-in-part of PCT application number PCT / US2008 / 14081, filed Dec. 26, 2008. All of these applications are herein incorporated by reference.FIELD OF THE INVENTION[0002]This application relates to cooling systems for microelectronics, including cooling systems for microelectronics that include microchannels.BACKGROUND OF THE INVENTION[0003]Microelectronic devices can generate significant amounts of heat in the course of their operation. The generated heat needs to be removed and dissipated, to prevent a catastrophic rise in operating temperature, which can impair the proper functioning of the devices, or even damage the electronic components. Conventionally, cooling devices attached to the heat-generating electronic co...

Claims

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Application Information

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IPC IPC(8): F28D15/00F28F9/02
CPCH05K7/20309F28D15/0266
Inventor SCHON, STEVEN G.
Owner QCIP HLDG
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