Circuit substrate and manufacturing method thereof

Abstract

A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. At least a through hole passing through the sealed area is formed. Two insulating layers are formed on the two metal layers. Two conductive layers are formed on the two insulating layers. The two insulating layers and the two conductive layers are laminated to the two metal layers bonded to each other, wherein the metal layers are embedded between the two insulating layers, and the two insulating layers fill into the through hole. The sealed area of the two metal layers is separated to form two separated circuit substrates. Therefore, the thinner substrate can be operated in the following steps, such as patterning process or plating process. In addition, the method may be extended to manufacture the circuit substrate with odd-numbered layer or even-numbered layer.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of Taiwan application serial no. 98145638, filed on Dec. 29, 2009, Taiwan application serial no. 99112313, filed on Apr. 20, 2010, and Taiwan application serial no. 99141954, filed on Dec. 2, 2010. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of specification.BACKGROUND[0002]1. Field of the Invention[0003]The invention relates to a circuit substrate and a manufacturing method thereof. Particularly, the invention relates to a coreless circuit substrate and a manufacturing method thereof.[0004]2. Description of Related Art[0005]In a current semiconductor manufacturing process, a chip package carrier is one of commonly used packaging components. The chip package carrier is, for example, a multi-layer circuit board, which is mainly formed by alternately stacking multiple circuit layers and a multiple dielectric layers, whe...

AI Technical Summary

Benefits of technology

[0008]The invention is directed to a circuit substrate and a manufacturing method thereof, which can reduce manufacturing steps and production cost, and improve production yield to improve reliability of products.

[0025]According to the above descriptions, in the invention, the peripheries of two metal layers are first bonded to form a sealed area. After lamination of two insulating layers and two conductive layers is completed, the two metal layers are separated. Therefore, compared to the conventional technique, the manufacturing method of the circuit substrate of the invention does not require a metal substrate to serve as a support carrier, namely, a coreless circuit substrate structure is achieved, which may effectively reduce the manufacturing cost of the circuit substrate and improve reliability thereof, and effectively reduce a time required for manufacturing the circuit substrate.

Problems solved by technology

Since the substrate with a certain thickness hast to be provided to serve as the support carrier of a copper foil layer according to the conventional technique, if a material of the substrate is a metal material, material cost thereof is relatively high, so that manufacturing cost of the multi-layer circuit board is increased.

Moreover, a large amount of adhesive is required for fixing the copper foil layer and the substrate, so that the adhesive is hard to be removed, and a production yield cannot be improved.

In addition, regarding the circuit layer formed through electroplating, copper thickness evenness thereof is poor, so that when the required thickness of the circuit layer is relatively thin, a thinning process (for example, an etching process) is required to reduce the thickness of the circuit layer.

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