Fin and heat sink having the same

Abstract

The present invention provides a fin and a heat sink. The fin includes a body having at least one first through-hole and at least one first protrusion. The first protrusion extends from the first through-hole toward one side of the body to form a first protruding end. At least one first notch is provided on the body in communication with the first through-hole. The fins are stacked up to form a fin set. A first heat pipe penetrates the fin set to constitute the heat sink. The first heat pipe penetrates the first through-hole while the first notch is expanded, so that the first protruding end tightly abuts against the first heat pipe. In this way, the structural strength of the fin is improved, the first heat pipe is protected from wearing due to the rubbing of fins against the heat pipe, and the heat-conducting efficiency is increased.

Description

[0001]This application claims the priority benefit of Taiwan patent application number 099115435 filed on May 14, 2010.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a fin and a heat sink having the same, and in particular to a fin capable of preventing the surface of a heat pipe from wearing, increasing the structural strength of the fin, and increasing the heat-conducting efficiency of the fin.[0004]2. Description of Prior Art[0005]With the advancement of semiconductor technology, the volume of an integrated circuit is reduced. In order to make the integrated circuit to process greater amount of data, several times of electronic elements than before are mounted on the integrated circuit of the same volume. The more the electronic elements mounted on the integrated circuit are, the greater the heat generated by the electronic elements is. Taking a central processor as an example, the heat generated by the central processor in its he...

AI Technical Summary

Benefits of technology

The present invention provides a fin and a heat sink with the fins. The fin has a body with at least one through-hole and at least one first protrusion, which increases the heat-conducting efficiency and the structural strength of the fin. The fin also has at least one first notch formed on the body in communication with the first through-hole. The fins are stacked up to form a fin set. The first heat pipe penetrates the first through-holes of the fins to form a heat sink. The first protruding end of the first protrusion can tightly abut against the first heat pipe due to the expansion of the first notch, thereby increasing the total structural strength of the fins. The heat-conducting efficiency is increased greatly. The present invention has advantages of increased structural strength, protected surface of the heat pipe from wearing, and increased heat-conducting efficiency.

Problems solved by technology

Taking a central processor as an example, the heat generated by the central processor in its heavy load may even burn down the central processor.

Thus, it is an important issue to provide a heat sink for the integrated circuit.

(1) the heat-dissipating fins may suffer damage due to the penetration of the heat pipes;

(2) the heat pipe may be worn due to the rubbing of the heat-dissipating fins against the heat pipe; and

(3) the heat-conducting efficiency of the heat sink is reduced.

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