Methods and devices for forced air cooling of electronic flight bags

Abstract

An electronic flight bag computer (EFB) includes a housing defining first and second compartments that are fluidly isolated from and in thermal communication with one another. The first compartment contains electronic components connected to a user interface on an exterior portion of the housing for providing interactive flight related computation functions to a user. The second compartment contains a forced convection cooling component in thermal communication with the electronic components. The forced convection cooling component directs a flow of cooling fluid into the second compartment to convey heat produced by the electronic components out of the housing, such that the cooling fluid in the second compartment remains fluidly isolated from the electronic components in the first compartment of the housing.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to cooling of electronic components, and more particularly to cooling systems for electronics onboard aircraft.[0003]2. Description of Related Art[0004]Electronic Flight Bags (EFB's) are computers used by aircraft crews as a replacement for the traditional flight bags containing charts and flight data formerly carried by pilots onto aircraft. An EFB provides electronic maps, weather information, and other information for use by flight crews in flying modern aircraft. A typical EFB is integrated with the cockpit and is not typically removed from the cockpit except for maintenance or replacement.[0005]Temperature control for electronic components, and particularly computer processors, is an issue for computing devices like EFB's. Various measures have been taken to maintain safe temperatures for electronic components in computers, which vary from application to application. Electronics used i...

AI Technical Summary

Benefits of technology

This solution provides efficient heat removal with a favorable power dissipation to form factor ratio, protecting electronic components from contaminants and enabling easier maintenance, extending the time between EFB removal for maintenance and reducing the risk of premature failure.

Problems solved by technology

Temperature control for electronic components, and particularly computer processors, is an issue for computing devices like EFB's.

Since motors such as those used in typical cooling fans have a relatively low reliability compaired to electronics typically used in aerospace applications, fans are often not used in conventional EFB equipment because it is necessary to replace a typical cooling fan before what is considered a reasonable time to failure.

Moreover, in conventional EFB's using a cooling fan to blow air over electronic components can lead to early failure of an EFB if common contaminants like dust, moisture, or salt are entrained in the airflow.

Additionally, fans may of themselves also lead to early failure of EFB's.

Fans can fail due to vibration and temperature extremes, which reduces the Mean Time to Failure of an EFB.

Instead of cooling fans, many conventional EFB's employ elaborate passive cooling provisions which typically add cost and bulk to the design.

These traditional means for cooling EFB's may also result in a compromise in capability or reduced operating environmental limits.

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