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Highly pure copper anode for electrolytic copper plating, method for manufacturing same, and electrolytic copper plating method

a technology of high-purity copper and anode, which is applied in the direction of electrolytic devices, etc., can solve the problems of increasing the occurrence of plating defects, and achieve the effect of suppressing the formation of anode slime and preventing the formation of plating defects, such as nodular deposits

Inactive Publication Date: 2013-03-28
MITSUBISHI MATERIALS CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

The invention relates to a method for manufacturing a highly pure copper anode for electrolytic copper plating. The method prevents the formation of anode slime, prevents contamination on the inner surface of through-holes, and prevents plating defects such as nodular deposits, even when plating onto printed-wiring boards. The technical effect is improved quality and efficiency in electrolytic copper plating.

Problems solved by technology

The slimes drifted into the bath adhere to the surface of cathode electrode, increasing occurrence of plating defects, such as nodules or the like.

Method used

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  • Highly pure copper anode for electrolytic copper plating, method for manufacturing same, and electrolytic copper plating method
  • Highly pure copper anode for electrolytic copper plating, method for manufacturing same, and electrolytic copper plating method
  • Highly pure copper anode for electrolytic copper plating, method for manufacturing same, and electrolytic copper plating method

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[0060]Highly pure copper anodes (referred to as anodes of the present invention) 1 to 20 having the prescribed sizes shown in Table 3 were manufactured. The anodes of the present invention 1 to 20 were manufactured by carrying out hot working (temperature, processing method, processing rate), cold working (processing method, processing rate) and / or recrystallization heat treatment (temperature, time) under the conditions shown in Table 1, or repeating these processes on recrystallized materials or cast materials of highly pure copper of the tough pitch pure copper (TPC) with a purity of 99.9% by mass or higher, the highly pure copper (4N OFC) with a purity of 99.99% by mass or higher, the highly pure copper (5N OFC) with a purity of 99.999% by mass or higher, and the highly pure copper (6N OFC) with a purity of 99.9999% by mass or higher shown in Table 1. After the heat treatment, the anodes 1 to 20 of the present invention were water-cooled.

[0061]In the wire-drawing-cold-working pr...

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Abstract

Provided are a highly pure copper anode for electrolytic copper plating, a method for manufacturing the same, and an electrolytic copper plating method using the highly pure copper anode. The highly pure copper anode obtains a crystal grain boundary structure having a special grain boundary ratio LσN / LN of 0.35 or more. LN is a unit total special grain boundary length. LσN is a unit total special boundary length. By having the configuration described above, plating defect can be reduced by suppressing the occurrence of the particles, such as the slime or the like, which are generated on the anode side in the plating bath.

Description

TECHNICAL FIELD[0001]The present invention relates to a highly pure copper anode for electrolytic copper plating, a method for manufacturing the highly pure copper anode, and an electrolytic copper plating method using the highly pure copper anode. According to the highly pure copper anode, the method for manufacturing the copper anode, formation of particles, such as slimes or the like, which are generated on the anode side in an electrolytic plating bath, can be prevented during electrolytic plating using a copper pyrophosphate bath. Also, according to the electrolytic plating method using the highly pure copper anode, plating defect can be reduced due to formation of the particles.[0002]The present application claims priority on the basis of Japanese Patent Application No. 2010-077215, filed in Japan on Mar. 30, 2010, the contents of which are incorporated herein by reference.BACKGROUND ART[0003]Confectionary, a highly pure copper is used as an anode electrode for copper plating ...

Claims

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Application Information

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IPC IPC(8): C25D17/10C22F1/08
CPCC22F1/00C25D17/10C22F1/08
Inventor NAKAYA, KIYOTAKAKITA, KOICHIKUMAGAI, SATOSHIKATO, NAOKIWATANABE, MAMI
Owner MITSUBISHI MATERIALS CORP
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