Heat sink and method of forming a heatsink using a wedge-lock system

a technology of heat sink and heatsink, which is applied in the direction of metal-working apparatus, semiconductor devices, semiconductor/solid-state device details, etc., can solve the problems of high cost, limited material supply, and significant challenges in the management of component temperatur

Inactive Publication Date: 2013-04-18
GE INTELLIGENT PLATFORMS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This approach effectively lowers temperatures by 10°C or more, nearly doubling the power capacity of electrical systems in the same volume, enabling operation in higher ambient temperatures and reducing thermal interface resistance.

Problems solved by technology

The volumes typically do not change as the power dissipation of the components increase, presenting significant challenges in the management of component temperatures.
These materials, however, are only sufficient if a relatively large amount of surface area is presented to the airstream, necessitating a physically larger heatsink structure that occupies a large amount of the total available volume.
The diffusion bonding process, while resulting in a very good thermal contact between the TPG material and the aluminum structure, has limitations in that specialized equipment is needed to create the TPG-embedded structures in a time-consuming process, resulting in an expensive product.

Method used

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  • Heat sink and method of forming a heatsink using a wedge-lock system
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  • Heat sink and method of forming a heatsink using a wedge-lock system

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Embodiment Construction

[0016]The present disclosure is related to fastening thermo pyrolytic graphite (TPG) to a metal material for forming heatsinks. As used herein, “TPG” refers to any graphite-based material in which the graphite is aligned in one direction for optimal heat transfer. The materials are typically referred to as “aligned graphite”, “TPG”, and “Highly Oriented Pyrolytic Graphite (HOPG)”. The TPG elements provide improved thermal conductivity in the X-Y plane of the heatsink. More specifically, it has been found that by using the methods of fastening TPG elements to a metal material as provided in the present disclosure, temperatures created by the use of electrical systems, such as computer systems, can be lowered by about 10° C. or more as compared to conventional thermal solutions. This improved temperature release allows for almost a doubling of the electrical systems' power capacity in the same volume environment. Furthermore, the increase in power may result in systems being supported...

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Abstract

The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element.

Description

[0001]This application is a divisional of U.S. Ser. No. 11 / 966,201 filed on Dec. 28, 2007, the entire disclosure of which is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]This disclosure relates generally to methods of fastening thermo pyrolytic graphite (TPG) to metal materials to serve as heatsinks for various uses and, more particularly, to releasably fastening TPG elements to a metal material using a wedge-lock system to form a heatsink.[0003]Modern embedded computer systems contain very high thermal power electrical components in a volumetrically constrained environment. The volumes typically do not change as the power dissipation of the components increase, presenting significant challenges in the management of component temperatures. In the past, a variety of direct cooling techniques such as active or passive heatsinks composed of high thermally conductive materials such as aluminum and / or copper have been used to manage rising temperatures. These materia...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): F28F21/02
CPCH01L21/4882H01L23/367H01L23/373H01L23/4006H01L2023/4068H01L2023/4075H01L2924/0002H01L2924/3011F28F21/02Y10T29/4935H01L2924/00F28F3/02F28F21/084F28F21/085
InventorSLATON, DAVID S.MCDONALD, DAVID L.
OwnerGE INTELLIGENT PLATFORMS LTD