Heat sink and method of forming a heatsink using a wedge-lock system
a technology of heat sink and heatsink, which is applied in the direction of metal-working apparatus, semiconductor devices, semiconductor/solid-state device details, etc., can solve the problems of high cost, limited material supply, and significant challenges in the management of component temperatur
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[0016]The present disclosure is related to fastening thermo pyrolytic graphite (TPG) to a metal material for forming heatsinks. As used herein, “TPG” refers to any graphite-based material in which the graphite is aligned in one direction for optimal heat transfer. The materials are typically referred to as “aligned graphite”, “TPG”, and “Highly Oriented Pyrolytic Graphite (HOPG)”. The TPG elements provide improved thermal conductivity in the X-Y plane of the heatsink. More specifically, it has been found that by using the methods of fastening TPG elements to a metal material as provided in the present disclosure, temperatures created by the use of electrical systems, such as computer systems, can be lowered by about 10° C. or more as compared to conventional thermal solutions. This improved temperature release allows for almost a doubling of the electrical systems' power capacity in the same volume environment. Furthermore, the increase in power may result in systems being supported...
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