Metal copper clad laminate and method of manufacturing metal core printed circuit board using the same

Inactive Publication Date: 2013-05-23
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0009]An aspect of the exemplary embodiments may provide a metal copper clad laminate (MCCL) capable of maintaining thermal conductivity, avoiding damage to an insulating layer to prevent foreign objects, etc., from being detac

Problems solved by technology

However, damages may occur at a time of cutting the insulating layer.
Damages may occur due to the filler pro

Method used

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  • Metal copper clad laminate and method of manufacturing metal core printed circuit board using the same
  • Metal copper clad laminate and method of manufacturing metal core printed circuit board using the same
  • Metal copper clad laminate and method of manufacturing metal core printed circuit board using the same

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Example

[0028]A metal copper clad laminate (MCCL) and a method of manufacturing a metal core printed circuit board (MCPCB) using the same according to embodiments will be described with reference to the accompanying drawings. However, the embodiments may be modified in many different forms and the scope of the present embodiments should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the embodiments to those skilled in the art.

[0029]In the drawings, the shapes and dimensions of elements may be exaggerated for clarity. Further, the same reference numerals will be used throughout to designate the same or like elements.

[0030]An MCCL according to an embodiment will be described with reference to FIGS. 1 and 2.

[0031]FIG. 1 is a cross-sectional view schematically showing an MCCL according to an embodiment, and FIGS. 2A and 2B are cross-sectional views schematicall...

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Abstract

There are provided a metal copper clad laminate (MCCL) and a method of manufacturing a metal core printed circuit board (MCPCB) using the same. The MCCL includes a metal plate; a first polyimide adhesive layer laminated on the metal plate, the first polyimide adhesive layer having a shape corresponding to that of the metal plate so as not to expose an upper surface of the metal plate; a polyimide insulating layer laminated on the polyimide adhesive layer; and copper cladding laminated on the polyimide insulating layer.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the priority of Korean Patent Application No. 10-2011-0120866 filed on Nov. 18, 2011, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.BACKGROUND[0002]1. Field[0003]Embodiments relate to a metal copper clad laminate (MCCL) and a method of manufacturing a metal core printed circuit board (MCPCB) using the same.[0004]2. Description of the Related Art[0005]In the case of mounting an electronic component having a large amount of heat generation, e.g., a light emitting device using a light emitting diode (LED) on a substrate, a metal core printed circuit board (MCPCB) may be used in the related art to efficiently radiate heat generated in the electronic component through the substrate.[0006]An MCPCB may be manufactured by etching copper cladding of a metal copper clad laminate (MCCL) using a related art method of manufacturing a printed circuit board (PCB). The MCCL...

Claims

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Application Information

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IPC IPC(8): B32B15/08B32B27/28B32B3/26
CPCB32B3/26B32B15/08B32B27/281B32B7/12B32B15/20Y10T156/1052B32B3/30B32B2307/206B32B2457/08Y10T428/24612B32B3/266Y10T428/31721Y10T428/31678Y10T428/31681H05K1/03H05K7/20
Inventor KIM, YOUNG KYUNGKIM, YOUNG TAEK
Owner SAMSUNG ELECTRONICS CO LTD
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