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3D capacitor

Active Publication Date: 2014-05-15
EULEX COMPONENTS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides an MLCC device with multiple stacked capacitors that are connected with vias to wire-bondable pads on the top side of the ceramic chip, instead of requiring solder connections to terminals on the ends. This arrangement reduces the footprint of a given capacitor complement while avoiding the space requirements of solder fillets. The invention alleviates space-related concerns and provides a more efficient solution for capacitor arrangement in MLCC devices.

Problems solved by technology

In addition, stacking the capacitors vertically that way, along the Z axis, results in a small footprint for a given number of capacitors.

Method used

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Experimental program
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second embodiment

[0062]Now consider FIGS. 8 and 9. They show an MLCC device constructed according to the invention that is identified as a device 200. The device 200 is similar in many respects to the device 100 and so only differences will be described in further detail. For convenience, reference numerals identifying many parts of the device 200 are increased by one hundred over those identifying similar, related, or associated parts of the device 100.

[0063]Similar to the MLCC device 100, the MLCC device 200 includes a plurality of electrically conductive layers embedded within a ceramic chip 211. The ceramic chip 211 may be similar in some respects to the ceramic chip 111, with a similar overall size and shape, and it may be fabricated in a similar manner using green dielectric ceramic tape. The major differences lie in (i) the number, placement, and pairing of the plurality of electrically conductive layers, (ii) the plurality of upwardly facing wire-bondable pads on the top side 201, (iii) the ...

third embodiment

[0067]FIGS. 10 and 11 show an MLCC device constructed according to the invention that is identified as a device 300. The device 300 is similar in many respects to the device 100 and so only differences will be described in further detail. For convenience, reference numerals identifying many parts of the device 300 are increased by two hundred over those identifying similar, related, or associated parts of the device 100.

[0068]Similar to the MLCC device 100, the MLCC device 300 includes a plurality of electrically conductive layers embedded within a ceramic chip 311. The ceramic chip 311 may be similar in some respects to the ceramic chip 111, with a similar overall size and shape, and it may be fabricated in a similar manner using green dielectric ceramic tape. The major differences lie in (i) the number, placement, and pairing of the plurality of electrically conductive layers, (ii) the four upwardly facing wire-bondable pads on the top side 301, (iii) the four vias connecting the ...

fourth embodiment

[0072]FIGS. 12 and 13 show an MLCC device constructed according to the invention that is identified as a device 400. The device 400 is similar in many respects to the device 100 and so only differences will be described in further detail. For convenience, reference numerals identifying many parts of the device 400 are increased by three hundred over those identifying similar, related, or associated parts of the device 100.

[0073]Similar to the MLCC device 100, the MLCC device 400 includes a plurality of electrically conductive layers embedded within a ceramic chip 411. The ceramic chip 411 may be similar in some respects to the ceramic chip 111, with a similar overall size and shape, and it may be fabricated in a similar manner using green dielectric ceramic tape. The major differences lie in (i) the number, placement, and pairing of the plurality of electrically conductive layers, (ii) the two upwardly facing wire-bondable pads on the top side 401 of the ceramic chip 411, (iii) the ...

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Abstract

A multi-layer ceramic capacitor (MLCC) device includes a ceramic chip having electrically conductive layers embedded within the chip that form one or more capacitors connected by one or more vias to one or more upwardly facing wire-bondable pads on the top side of the device. One embodiment includes electrically conductive layers that form at least two stacked capacitors connected by vias to multiple upwardly facing wire-bondable pads on the top side, whereby the MLCC device has a reduced footprint while avoiding solder fillets. The wire-bondable pads may lie in a common plane or be pyramidally stepped. Metallization on the PCB-facing bottom side and at least one of the ends of the ceramic chip of another embodiment forms a downwardly facing capacitor terminal.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of U.S. Provisional Patent Application Ser. No. 61 / 726,997 filed Nov. 15, 2012, and the benefit of U.S. Provisional Patent Application Ser. No. 61 / 822,352 filed May 11, 2013.BACKGROUND OF THE INVENTION[0002]1. Technical Field[0003]This invention relates generally to ceramic capacitors, and more particularly to a multi-layer ceramic capacitor (MLCC) device that provides more functionality while requiring less printed circuit board space.[0004]2. Description of Related Art[0005]A typical MLCC device is a tiny electronic component having spaced-apart capacitor electrodes in the form of electrically conductive layers embedded in interleaving and overlapping relationships within a ceramic chip. The manufacturer often produces batches of such devices using green dielectric ceramic tape on which a worker has printed the electrically conductive layers in desired patterns. After layering multiple pieces of the gr...

Claims

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Application Information

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IPC IPC(8): H01G4/38H05K3/32
CPCH05K3/32H01G4/385H01G4/012H01G4/12H01G4/232H01G4/30H05K3/328H05K2201/10015H05K2203/049Y10T29/4913
Inventor ARMSTRONG, EUAN PATRICKMOALEMI, ALI
Owner EULEX COMPONENTS INC