Module and Assembly with Dual DC-Links for Three-Level NPC Applications

Inactive Publication Date: 2014-09-11
LITTELFUSE INC
View PDF4 Cites 28 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009]In one application, by turning a first such module one-hundred eighty degrees with respect to a second identical module, and by connecting the two modules together with metal bus bars, two identical instances of the module are interconnected to form a three-level NPC phase leg that exhibits low stray inductances. The three-level NPC phase leg involves two DC-links that are connected together in parallel. By splitting the circuitry of a T-type three-level NPC circuit into two identical halves, each of which includes a separate DC-link, and by providing the AC power terminal of the DC-link (the fourth power terminal) close to the AC power terminal of the main IGBT (the third power terminal) in each module, the area enclosed by main conduction and commutation current loops is reduced as compared to other multi-module realizations of the T-type three-level NPC circuit. Due to the smaller current loops, stray inductances are reduced as compared to stray inductances in a multi-mod

Problems solved by technology

In a higher power application, a T-type three-level NPC phase leg circuit may have to be realized in multiple module packages due to heat d

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Module and Assembly with Dual DC-Links for Three-Level NPC Applications
  • Module and Assembly with Dual DC-Links for Three-Level NPC Applications
  • Module and Assembly with Dual DC-Links for Three-Level NPC Applications

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028]Reference will now be made in detail to embodiments of the invention, examples of which are illustrated in the accompanying drawings.

[0029]FIG. 3 is a top-down diagram of a power semiconductor NPC module 20. The module 20 includes an injected molded plastic housing 21 having a central tray-shaped enclosure portion and four laterally-extending tab-like extension portions. The plastic housing 21 extends around a metal base plate that forms the bottom of the central enclosure portion. A cap or lid is provided to cap the central enclosure portion. The cap provides mechanical strength. Four power terminals 22-25 extends outward from the housing 21 as illustrated. The power terminals are standard screw terminals for attachment to electrical bus bars or wires. Each power terminal has a threaded fastening hole or a nut for engaging the threads of a screw. The housing 21 can be attached to a heatsink via screws (not shown) so that the metal base plate is in good thermal contact with th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A power semiconductor module has four power terminals. An IGBT has a collector connected to the first power terminal and an emitter coupled to the third power terminal. An anti-parallel diode is coupled in parallel with the IGBT. A DC-link is connected between the second and fourth power terminals. The DC-link may involve two diodes and two IGBTs, where the IGBTs are connected in a common collector configuration. The first and second power terminals are disposed in a first line along one side of the module, and the third and fourth power terminals are disposed in a second line along the opposite side of the module. Two identical instances of the module can be interconnected together to form a three-level NPC phase leg having low stray inductances, where the phase leg has two parallel DC-links.

Description

TECHNICAL FIELD[0001]The described embodiments relate to power semiconductor modules usable in three-level NPC phase leg applications.BACKGROUND INFORMATION[0002]FIG. 1 (Prior Art) is a diagram of a T-type three-level Neutral-Point-Clamped (NPC) phase leg module 1. Such a module sees use in applications including solar inverter, motor drive and UPS applications. The module is referred to as a “three-level” module because the module couples an output node AC to a selected one of three DC voltage power terminals. As compared to conventional two-level topologies, a T-type three-level topology may provide advantages in a given application. For example, a T-type three-level topology may allow transistors within the module to have lower breakdown voltages than they would otherwise be required to have were a two-level topology used, with the added advantages of better conduction and switching performance resulting in lower losses. Also a T-type three-level topology may allow a motor to be ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L29/739H01L23/00
CPCH01L24/96H01L29/7393H01L2924/13055H01L2924/1305H02M7/003H02M7/487H01L24/06H01L24/45H01L24/48H01L24/49H01L2224/0603H01L2224/45015H01L2224/45124H01L2224/48139H01L2224/48227H01L2224/48472H01L2224/49111H01L2924/19107H01L25/072H01L2224/04042H01L2924/00H01L2924/2076H01L2924/00014H01L21/56H01L25/0652H01L27/0647
Inventor LASCHEK-ENDERS, ANDREAS
Owner LITTELFUSE INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products