Module and Assembly with Dual DC-Links for Three-Level NPC Applications
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[0028]Reference will now be made in detail to embodiments of the invention, examples of which are illustrated in the accompanying drawings.
[0029]FIG. 3 is a top-down diagram of a power semiconductor NPC module 20. The module 20 includes an injected molded plastic housing 21 having a central tray-shaped enclosure portion and four laterally-extending tab-like extension portions. The plastic housing 21 extends around a metal base plate that forms the bottom of the central enclosure portion. A cap or lid is provided to cap the central enclosure portion. The cap provides mechanical strength. Four power terminals 22-25 extends outward from the housing 21 as illustrated. The power terminals are standard screw terminals for attachment to electrical bus bars or wires. Each power terminal has a threaded fastening hole or a nut for engaging the threads of a screw. The housing 21 can be attached to a heatsink via screws (not shown) so that the metal base plate is in good thermal contact with th...
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