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Substrate processing apparatus and substrate processing method

a substrate processing and processing apparatus technology, applied in the direction of cleaning processes and apparatus, chemistry apparatus and processes, cleaning using liquids, etc., can solve the problems of affecting the processing efficiency of substrates, so as to prevent damage to substrates, prevent clogging of flow passages, and improve throughput

Inactive Publication Date: 2015-01-22
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention aims to prevent clogging and damage to a substrate caused by a frozen film during a substrate processing process. It achieves this by allowing the thawing liquid to flow in a common flow passage with the cooling gas, which prevents the cooling gas from coming into contact with the substrate and warming up. This results in faster thawing of the frozen film and improved throughput. The invention also includes a method for quickly discharging the thawing liquid from the thawing liquid discharge nozzle to the substrate by retracting it in advance, allowing for quicker thawing of the frozen film.

Problems solved by technology

At this time, there is a possibility that the thawing liquid of a reduced temperature remains in the pipe leading to the thawing liquid discharge nozzle from the thawing liquid supplier.
If such a thawing liquid of a reduced temperature is supplied to the frozen film, the progress of thawing is delayed and the partly remaining frozen film may damage the substrate.

Method used

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  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method

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Embodiment Construction

[0034]FIG. 1 is a side view diagrammatically showing one embodiment of a substrate processing apparatus according to the invention. FIG. 2 is a plan view showing the arrangement and moving modes of nozzles. This substrate processing apparatus 1 functions as a single-wafer substrate cleaning apparatus capable of performing a substrate cleaning process to remove extraneous matters such as particles adhering to a surface (pattern forming surface) Wf of a substrate W such as a semiconductor wafer. More specifically, this substrate processing apparatus 1 performs a freeze cleaning process of removing extraneous matters adhering to the substrate W together with a frozen film by removing the frozen film after forming a liquid film on the surface Wf of the substrate W and freezing the liquid film as the substrate cleaning process.

[0035]The substrate processing apparatus 1 includes a processing chamber 10 internally provided with a processing space SP in which a cleaning process is applied t...

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Abstract

A substrate processing apparatus comprises: a liquid film former which forms a liquid film by supplying a liquid on an upper surface of the substrate W held horizontally; a cooling gas discharge nozzle which discharges cooling gas of a temperature lower than a freezing point of the liquid forming the liquid film to the liquid film; a thawing liquid discharge nozzle which discharges a thawing liquid to a frozen film formed by freezing the liquid film; a thawing liquid supplier which supplies the heated thawing liquid to the thawing liquid discharge nozzle via a pipe; and a receiver which receives the cooling gas and the thawing liquid respectively discharged from the cooling gas discharge nozzle and the thawing liquid discharge nozzle at the respective retracted position and guides the cooling gas and the thawing liquid to a common flow passage.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]The disclosure of Japanese Patent Applications enumerated below including specifications, drawings and claims is incorporated herein by reference in its entirety:[0002]No. 2013-147433 filed on Jul. 16, 2013; and[0003]No. 2013-147434 filed on Jul. 16, 2013.BACKGROUND OF THE INVENTION[0004]1. Field of the Invention[0005]This invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate by forming a liquid film on a substrate, freezing the liquid film and thawing the frozen film.[0006]2. Description of the Related Art[0007]A freeze cleaning technology has been and is being studied as a cleaning technology for removing extraneous matters such as particles adhering to a substrate. This technology is for separating extraneous matters utilizing a volumetric change when a liquid is frozen by forming a liquid film on a surface of a substrate as an object to be processed, freezing the liquid film ...

Claims

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Application Information

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IPC IPC(8): B08B3/10
CPCB08B3/10B08B7/0014H01L21/6715H01L21/02052
Inventor KATO, MASAHIKOMIYA, KATSUHIKOYASHIKI, HIROYUKI
Owner DAINIPPON SCREEN MTG CO LTD
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