Plating film, method of manufacturing plating film, and plated product
a plating film and film technology, applied in the direction of cell components, coatings, printing, etc., can solve the problems of uneven expression of functionalities film peeling, and particle distribution in the plating film, so as to improve the homogeneity and reliability of characteristics and improve the durability of the plating film
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embodiment
1. Embodiment
[0020]1-1. Structure of plating film
[0021]1-2. Method of manufacturing plating film
2. Application Examples
3. Examples
1. Embodiment
1-1. Structure of Plating Film
[0022]FIG. 1 schematically illustrates a sectional structure of a plating film (a plating film 10) according to an embodiment of the disclosure. The plating film 10 is formed of a metal (a plating metal 11) and a compound having functionality (a functional compound 12), and provides a function of water repellency, oil repellency, lubricity, or the like to an object to be plated such as a metal product and a metal component. In the present embodiment, for example, the plating film 10 may be formed, by non-aqueous plating, in a state where the plating metal 11 and the functional compound 12 are homogeneously dispersed as illustrated in FIG. 1. Here, homogeneous indicates a state in which the functional compound 12 is uniformly distributed without deviation in an in-plane direction and a film thickness direction of...
application examples
2. Application Examples
[0055]The plating film 10 described in the above-described embodiment is applicable to various kinds of plated products. Specifically, the plating film 10 may be applicable to, for example, a metal product, a metal component, a gear, a bearing, an edge of a skate, a ski board, a snowboard, and the like. As a result, rust-proof function, lubricity, and the like are imparted to the above-described products. In addition, it is possible to impart corrosion resistance and acid resistance of metal against corrosive gas, etc.
[0056]Further, for example, it is possible to prevent adhesion of barnacles to seawater suction port of an electric generation plant, ship bottom, or the like, to facilitate demolding of a resin molded product from a mold, and to make adhered substance hard to remain to a blade. Alternatively, it becomes possible to use the plating film 10 in prevention of residue in a nozzle that discharges viscous liquid such as an adhesive, in control of fluid...
example 1
[0059]For example, 100 g of tin chloride (the metallic salt of the plating metal 11) was dissolved in 300 ml of 4-butyrolactone (the plating solvent) to prepare the plating solution R. The plating solution was placed in Hull cell tester (trademark; Yamamoto-MS Co., Ltd.) that was made of glass and was attached with the anode electrode 32 and the cathode electrode 33 as illustrated in FIG. 3A, and the plating solution was maintained at temperature of 70° C. while being stirred with a rotor. Here, the plating metal and the metal to be plated were used as is as the anode electrode and the cathode electrode, respectively. In this state, the AC voltage that had the AC waveform illustrated in FIG. 4 and whose parameters were set to those in voltage condition 1 was applied to perform the plating operation. As a result, the plating film 10 (Example 1-1) was obtained. Besides, the plating films 10 in respective Examples 1-2, 1-3, and 1-4 were obtained with use of similar procedure. Condition...
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Abstract
Description
Claims
Application Information
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