Thermal conducting structure applied to network control automation system
a technology of network control and conducting structure, applied in the direction of circuit thermal arrangement, cooling/ventilation/heating modification, modification by conduction heat transfer, etc., can solve the problem of hard to limit the strength and direction of user's force during plugging connection of circuit modules, and achieve better overall heat dissipation efficiency, easy separation of workpieces from molds, and improved heat dissipation area
Active Publication Date: 2017-03-09
ADLINK TECH INC
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Benefits of technology
This solution effectively increases the heat dissipation area and improves overall heat dissipation efficiency, maintaining system stability and performance by conducting heat from the circuit module to the cooler bracket, while also protecting the components from physical damage and noise interference.
Problems solved by technology
In addition, it is hard to limit the strength and direction of user's force during plugging connection of the circuit module, the outer shell member of the positioning structure can prevent the multiple sets of the circuit modules from being damaged or broken because of being impacted with each other.
Method used
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[0019]Reference will now be made in detail to the exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Therefore, it is to be understood that the foregoing is illustrative of exemplary embodiments and is not to be construed as limited to the specific embodiments disclosed, and that modifications to the disclosed exemplary embodiments, as well as other exemplary embodiments, are intended to be included within the scope of the appended claims. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the inventive concept to those skilled in the art. The relative proportions and ratios of elements in the drawings may be exaggerated or diminished in size for the sake of clarity and convenience in the drawings, and such arbitrary proportions are only illustrative and not limiting in any way. The same reference numbers are used in the drawings and the description to refer to the ...
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The present disclosure provides a thermal conducting structure applied to a network control automation system. A circuit board defines bare copper regions located at two opposite sides thereof, and copper foil layers are disposed on bare copper regions and cover sliding edges on two side panels to form a thermal conducting path. An accommodation open chamber is formed between outer shell member and two side panels thereof for positioning circuit board, the two side panels of outer shell member have elastic convex parts disposed on surfaces thereof. The circuit module cooperating with positioning structure can be inserted into docking chamber by slidably mounting sliding edge along mounting part from opening, and elastic convex parts are abutted with sidewall around mounting parts to form thermal conducting path, so that heat generated during operation can be conducted to cooler bracket thereby increasing entire heat dissipation area and further improving heat dissipation efficiency.
Description
BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present disclosure relates to a thermal conducting structure applied to a network control automation system, more particularly to a thermal conducting structure capable of conducting the heat generated during operation of the heat source of the circuit module to a cooler bracket for heat dissipation via copper foil layers located at two opposite side ends of the circuit board in cooperation with the positioning structure, so as to improve overall heat dissipation efficiency.[0003]2. Description of the Related Art[0004]With the rapid development of electronic technology, computers, laptops and other computer equipment are ubiquitous in every corner of society, and their development trend towards high computing power, fast speed and small size. However, with open framework of the computer equipment, standardization of software and hardware and continuous expansion and upgrading in functions, manufacturers start to dev...
Claims
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IPC IPC(8): H05K1/02H05K7/20
CPCH05K7/2039H05K1/0209H05K7/20409H05K7/20545
Inventor YU, CHIA-TE
Owner ADLINK TECH INC