Power module

a power module and power technology, applied in the field of power modules, can solve the problems of power modules that power modules can be damaged by surge, and large capacitors cannot be mounted inside the power modules, so as to achieve the effect of increasing yield strength

Active Publication Date: 2017-08-03
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a power module with enough space for a large electronic component and increased yield strength against external stresses, such as vibrations. The power module has terminals that are spaced from each other in the width direction and longer in the height direction than the first electronic component, which allows for a sufficient space for disposing the large electronic component between the circuit substrate and the power module and supports the circuit substrate with the pair of terminals.

Problems solved by technology

The power module can. be damaged by the surge voltage if a voltage greater than a maximum rated voltage of the power module is applied to the power module.
It is difficult to sinter a dielectric together with a lead at high temperature when a large capacitor in size is formed inside the conventional power module.
As a result, such a large capacitor cannot be mounted inside the power module.
Further, the film capacitor that has a high breakdown voltage and a high frequency characteristic is large in size, and the film capacitor thus requires a large space when mounted on the circuit substrate.
Hence, it is difficult to mount the large capacitor between the circuit substrate and the power module mounted on the circuit substrate.
Because of this difficulty, the circuit substrate has a restriction where, for instance, tall electronic components need to he mounted on a surface opposite to a surface on which the power module is mounted.
Although apparatuses described in Japanese Patent Application Laid-Open No. 2007-151331 and Japanese Patent Application Laid-Open No. 2005-328651 are configured such that capacitors are disposed inside power modules, as described above, it is difficult to dispose large capacitors in size inside the power modules.
As a result, the electrode terminal unfortunately has a poor contact doe to external stresses, such as vibrations.

Method used

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first preferred embodiment

[0022]The following describes a first preferred embodiment, of the present invention with reference to a drawing.

[0023]FIG. 1 is a cross-sectional view of a power module 10 according to the first preferred embodiment fixed to a control substrate 16. As illustrated in FIG. 1, the power module 10 includes a base plate 11, insulating substrates 12, semiconductor elements 18, a sealant 30, and a pair of terminals 15. The insulating substrates 12 are each fixed on the top surface of the base plate 11. Moreover, the insulating substrates 12 each include a pattern 13 formed on the top surface of the insulating substrate 12. The semiconductor elements 18 are fixed (mounted) above the top surfaces of the patterns 13 through solder 14. The insulating substrates 12 are each made of a material having an excellent insulation characteristic and thermal conductivity.

[0024]Here, the insulating substrate 12 and the base plate 11 may be an integral structure. Moreover, the semiconductor elements 18 a...

second preferred embodiment

[0031]The following describes a power module 10A according to a second preferred embodiment. FIG. 2 is a cross-sectional view of a power module 10A according to a second preferred embodiment fixed to a control substrate 16. In the second preferred embodiment, like elements described in the first preferred embodiment will be denoted by tike reference symbols. Thus, descriptions of these like elements will be omitted.

[0032]In the second preferred embodiment, the power module 10A includes a pair of terminals 15a instead of the pair of terminals 15. The pair of terminals 15a are wider than a film capacitor 17. The pair of terminals 15a have inner side-surfaces adjacent to the side surfaces of the film capacitor 17 in a width direction.

[0033]As described above, the power module 10A according to the second preferred embodiment is configured such that the pair of terminals 15a are wider than the film capacitor 17. Such a configuration enables the power module 10A to have further increased ...

third preferred embodiment

[0035]The following describes a power module 10B according to a third preferred embodiment. FIG. 3 is a cross-sectional view of a power module 10B according to the third preferred embodiment fixed to a control substrate 16. In the third preferred embodiment, like elements described in the first and second preferred embodiments will be denoted by like reference symbols. Thus, descriptions of these like elements will be omitted.

[0036]In the third preferred embodiment, the power module 10B includes a pair of terminals 15b instead of the pair of terminals 15 with respect to the first preferred embodiment. A film capacitor 17 and a cement resistor 19 (second electronic component) are mounted on the bottom surface of the control substrate 16. The cement resistor 19 is mounted on the bottom surface of the control substrate 16, at a position adjacent to the film capacitor 17.

[0037]The pair of terminals 15b are spaced from each other in a width direction by a distance greater than the sum of...

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PUM

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Abstract

Provided is a power module having a sufficient space in which a large electronic component in size is disposed, and having yield strength against external stresses, such as vibrations. A power module includes: an insulating substrate; a semiconductor element mounted above the insulating substrate; a sealant sealing the insulating substrate and semiconductor element, and forming the outer shape of the power module; and a pair of terminals disposed on the sealant, in both ends of the sealant in a width direction of the power module in an upright manner. The pair of terminals are spaced from each other by a distance greater than the width of a film capacitor being a first electronic component mounted on the bottom surface of a control substrate being a circuit substrate coupled to tips of the pair of terminals. The pair of terminals are longer in a height direction than the film capacitor.

Description

BACKGROUND OF THE INVENTION[0001]Field of the Invention[0002]The present invention relates to power modules for reducing the space utilized by electronic components mounted on circuit substrates used for, for instance, controlling motors of industrial equipment or consumer equipment.[0003]Description of the Background Art[0004]A conventional power module, when driven, can generate an off-surge voltage. The power module can. be damaged by the surge voltage if a voltage greater than a maximum rated voltage of the power module is applied to the power module. To reduce or eliminate the surge voltage, a film capacitor, called a snubber capacitor, needs to be mounted on a circuit substrate near the power module. Accordingly, a power module that has a capacitor embedded inside the power module has been proposed (for instance, see Japanese Patent Application Laid-Open No. 2007-151331 and Japanese Patent Application Laid-Open No. 2005-328651).[0005]However, a high dielectric material used fo...

Claims

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Application Information

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IPC IPC(8): H01L49/02H01L29/16
CPCH01L29/1608H01L28/40H01L25/072H01L25/16H01L25/04
InventorHIRAI, TOSHINARITSUNODA, TETSUJIROICHIMURA, TORUYAMAMOTO, MASANORIFUJITA, HIROSHI
OwnerMITSUBISHI ELECTRIC CORP