Package structure and manufacturing method thereof

Abstract

A package structure including a redistribution structure, a die, at least one connecting module, a first insulating encapsulant, a chip stack, and a second insulating encapsulant. The die is disposed on and electrically connected to the redistribution structure. The connecting module is disposed on the redistribution structure. The connecting module includes a protection layer and a plurality of conductive bars embedded in the protection layer. The first insulating encapsulant encapsulates the die and the connecting module. The chip stack is disposed on the first insulating encapsulant and the die. The chip stack is electrically connected to the connecting module. The second insulating encapsulant encapsulates the chip stack.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of U.S. provisional application Ser. No. 62 / 591,166, filed on Nov. 27, 2017. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of specification.BACKGROUND OF THE INVENTIONField of the Invention[0002]The disclosure generally relates to a package structure and a manufacturing method thereof, and in particular, to a package structure having a connecting module and a manufacturing method thereof.Description of Related Art[0003]Development of semiconductor package technology in recent years has focused on delivering products with smaller volume, lighter weight, higher integration level, and lower manufacturing cost. For multi-functional semiconductor packages, a technique for stacking chips has been used to provide the packages with a larger capacity to store or process data. The rapid increase in demand for multi-functional electronic c...

AI Technical Summary

Benefits of technology

The patent text describes a package structure and a manufacturing method that reduces the size and cost of the package. This is achieved by using a prefabricated connecting module that can be easily adapted, eliminating the need for additional carrier or thicker copper pillars. Overall, this invention provides a more efficient and cost-effective solution for packaging semiconductors.

Problems solved by technology

The rapid increase in demand for multi-functional electronic components with the improved desired features has become a challenge to researchers in the field.

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