Manufacturing method of optoelectronic semiconductor device

Abstract

A manufacturing method of an optoelectronic semiconductor device includes: providing a matrix substrate, which comprises a substrate and a matrix circuit disposed on the substrate; transferring a plurality of micro-sized optoelectronic semiconductor elements from a temporary substrate to the matrix substrate, wherein the micro-sized optoelectronic semiconductor elements are separately disposed on the matrix substrate, and at least one electrode of each micro-sized optoelectronic semiconductor element is electrically connected with the matrix circuit; forming a protective layer completely covering the micro-sized optoelectronic semiconductor elements, wherein the height of the protective layer is greater than the height of the micro-sized optoelectronic semiconductor elements; and grinding the protective layer until a residual on a back surface of each micro-sized optoelectronic semiconductor element and the back surface are removed to expose a new surface.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This Non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application No(s). 107107726 filed in Taiwan, Republic of China on Mar. 7, 2018, the entire contents of which are hereby incorporated by reference.BACKGROUNDTechnology Field[0002]The present disclosure relates to a semiconductor device and, in particular, to an optoelectronic semiconductor device and a manufacturing method thereof.Description of Related Art[0003]A GaN-based light-emitting diode is epitaxial on, for example, a sapphire substrate. In the manufacturing process of an optoelectronic semiconductor device, in order to remove the sapphire substrate, the epitaxial wafer is permanently fixed to, for example, a silicon substrate by metal bonding, and then a laser lift-off (LLO) process for the sapphire substrate is performed. The LLO process is to dissociate the gallium nitride at the interface between the gallium nitride layer and the sapphire subst...

AI Technical Summary

Benefits of technology

The disclosed manufacturing method of an optoelectronic semiconductor device does not use acid to remove residues on the wafer back. Instead, a protective layer is formed to cover the entire micro-sized optoelectronic semiconductor elements, and then residues on the back surface are removed to expose a new surface that is away from the matrix substrate. This method increases the illumination efficiency of the manufactured optoelectronic semiconductor device without using a chemical to remove the residues.

Problems solved by technology

However, this temporary fixing force must be limited, otherwise it will obstruct the following huge amount transferring of the Micro LEDs.

These requirements increase the difficulty of selecting the material of the temporary substrate.

In some cases, no material can meet all of the above requirements.

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