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Tin alloy plating solution

Inactive Publication Date: 2019-12-26
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention relates to a tin alloy plating solution that has excellent stability and uniformity during use and storage over a long period of time. It contains a sulfide compound with an oxygen atom that increases water-solubility, a metal ion that stabilizes the compound, and an ether bond that makes the compound stable and complex with a metal ion nobler than tin. The tin alloy plating solution also contains a surfactant to improve the appearance of the plating film and uniformity of film thickness, and a complexing agent for tin to stabilize Sn2+ ions near neutrality. In addition, it contains an antioxidant to prevent oxidation of Sn2+, and a pH adjusting agent to adjust the tin alloy plating solution to an arbitrary pH range such as acidic, weakly acidic, neutral and the like. The solution also contains an antioxidant to prevent oxidation of Sn2+ and a pH adjusting agent to adjust the solution to an arbitrary pH range.

Problems solved by technology

In a tin alloy plating bath (liquid) to be used for forming a tin alloy plating film, for example, a tin-silver alloy plating film on a conductive object, when oxidation reduction potentials of tin ions and other metal ions (for example, silver ions) in the bath are significantly different from each other, it has been known that metal ions nobler than tin tend to form an insoluble salt or a metal simple substance and precipitate in the plating bath, whereby making it difficult to stably maintain the plating bath.
However, this bath contains a toxic cyan compound, so that it is extremely high toxic and causes various problems in handling.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0052]With an aqueous tin methanesulfonate solution were mixed methanesulfonic acid as a free acid, a sulfide compound wherein n=1 of the general formula (1) as a complexing agent, and a nonionic surfactant (polyoxyethylene and polyoxypropylene were added to ethylenediamine with a ratio of 50:50) and dissolved, and a silver methanesulfonate liquid was further added and mixed. And finally, ion exchange water was added to prepare a bath of an SnAg plating solution having the following composition. Incidentally, the aqueous tin methanesulfonate solution was prepared by electrolyzing a metal tin plate and the aqueous silver methanesulfonate solution was prepared by electrolyzing a metal silver plate, both in an aqueous methanesulfonic acid solution, respectively.

(Composition of SnAg Plating Solution)

[0053]Tin methanesulfonate (as Sn2): 50 g / L

[0054]Silver methanesulfonate (as Ag+): 0.5 g / L

[0055]Methanesulfonic acid (as free acid): 150 g / L

[0056]Sulfide compound (n=1): 5 g / L

[0057]Nonionic ...

example 2

[0059]An SnAg plating solution was prepared as a bath in the same manner as in Example 1 except that a sulfide compound wherein n=2 of the general formula (1) was used as a complexing agent.

example 3

[0060]An SnAg plating solution was prepared as a bath in the same manner as in Example 1 except that a sulfide compound wherein n=3 of the general formula (1) was used as a complexing agent.

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Abstract

A tin alloy plating solution comprising a soluble tin salt, a soluble salt of a metal nobler than tin, and a sulfide compound represented by general formula (I). In formula (I), n is 1 to 3. The metal nobler than tin is preferably silver, copper, gold, or bismuth.

Description

TECHNICAL FIELD[0001]The present invention relates to a tin alloy plating solution for forming a tin alloy plating film by electroplating method. More specifically, it relates to a tin alloy plating solution suitable for forming solder bumps for semiconductor wafers and printed circuit boards. This international application claims priorities based on Japanese Patent Application No. 15219 (Japanese Patent Application No. 2017-15219) filed on Jan. 31, 2017 and Japanese Patent Application No 222433 (Japanese Patent Application No. 2017-222433) filed on Nov. 20, 2017, and the entire contents of Japanese Patent Application No. 2017-15219 and Japanese Patent Application No. 2017-222433 are incorporated into this international application.BACKGROUND ART[0002]In a tin alloy plating bath (liquid) to be used for forming a tin alloy plating film, for example, a tin-silver alloy plating film on a conductive object, when oxidation reduction potentials of tin ions and other metal ions (for exampl...

Claims

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Application Information

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IPC IPC(8): C25D3/56C25D3/32
CPCC25D3/32C25D3/56C25D3/60C25D7/12
Inventor TATSUMI, KOUJIYASOSHIMA, TSUKASAKATASE, TAKUMA
Owner MITSUBISHI MATERIALS CORP
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