Secondary side heatsink techniques for optical and electrical modules
a technology of optical and electrical modules and heatsinks, applied in the direction of printed circuits, circuit thermal arrangements, printed circuit details, etc., can solve the problems of increasing capacity and density, increasing module power, and pcba design becoming significantly more complex and densely packed
Active Publication Date: 2021-03-18
CIENA
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- Abstract
- Description
- Claims
- Application Information
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Benefits of technology
The patent text describes a module for use in a hardware platform for networking, computing, and storage. The module includes a printed circuit board assembly with a primary side and a secondary side. The primary side has more physical space and includes electrical and optical components, while the secondary side has a heatsink for thermal management. The secondary side heatsink can be connected to either an electrical and optical component or an optical component on the primary side. The module can also include a cage for the optical component and a primary side heatsink for attachment to a faceplate. The technical effect of the patent text is to provide a module with improved thermal management for the components on the primary side of the printed circuit board assembly.
Problems solved by technology
Thermal management, i.e., cooling to dissipate heat, is a challenge in networking hardware (as well as compute, storage, etc. hardware).
The challenge is due to the ever-increasing capacity and density.
Modules are getting increasingly more powerful along with the PCBA design becoming significantly more complex and densely packed.
As a result, thermal management requirements are increasing, and the component placement locations are limited.
Further, as component placement is limited, there are techniques where components are being mounted on the secondary side.
Method used
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Embodiment Construction
[0021]The present disclosure relates to systems and methods for a secondary side heatsink for optical and electrical modules. In an embodiment, the systems and methods include a floating secondary side heatsink / heat spreader. In another embodiment, the systems and methods include a height-adjustable secondary side heatsink. In a further embodiment, the systems and methods include secondary side thermal management techniques. Variously, the systems and methods contemplate use in high density modules including pluggable optical and electrical modules and especially with space restricted PCBAs.
Floating Heatsink
[0022]FIGS. 1A and 1B are perspective diagrams of an example module 10 illustrating a primary side 12 (FIG. 1A) and a secondary side 14 (FIG. 1B). FIG. 2 is a side view diagram of the example module 10. FIGS. 3A and 3B are a top view (FIG. 3A) and a section view (FIG. 3B) of a conventional module 10A with a floating heatsink 20 on the primary side 12. FIGS. 4A and 4B are a top vi...
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Abstract
A module for use in a hardware platform for networking, computing, and / or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and / or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and / or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.
Description
FIELD OF THE DISCLOSURE[0001]The present disclosure generally relates to cooling via heatsinks of electrical and optical hardware. More particularly, the present disclosure relates to systems and methods for a secondary side heatsink for optical and electrical modules.BACKGROUND OF THE DISCLOSURE[0002]Thermal management, i.e., cooling to dissipate heat, is a challenge in networking hardware (as well as compute, storage, etc. hardware). The challenge is due to the ever-increasing capacity and density. As described herein, hardware includes electrical and / or optical components that are mounted on a Printed Circuit Board Assembly (PCBA). Networking, computing, and / or storage devices are formed via hardware modules which include the PCBA and which are typically engaged in a chassis, shelf, or the like, i.e., a hardware platform. A hardware module, or simply a module, may also be referred to as a circuit pack, a line module, a blade, etc. Modules are getting increasingly more powerful al...
Claims
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IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/0203H05K1/181H05K1/021H05K2201/066H05K2201/10265H05K2201/10189H05K2201/10734H05K2201/10416H05K2201/10409H05K2201/10121H05K7/205H01L23/40H01R4/30H01R4/48
Inventor O'LEARY, MITCHELLALDEA, VICTORRAHMANI, KAMRANMEUNIER, TREVORAJERSCH, PETERGRAHAM, TERENCELECLAIR, MARC
Owner CIENA