Substrate processing method and substrate processing apparatus

Abstract

A substrate processing method includes a first processing liquid supplying step of supplying a first processing liquid to an upper surface of the substrate, a holding layer forming step of solidifying or curing the first processing liquid to form a particle holding layer on the upper surface of the substrate, a holding layer removing step of peeling and removing the particle holding layer from the upper surface of the substrate, a liquid film forming step of forming, after removing the particle holding layer from the substrate, a liquid film of the second processing liquid, a solidifying step of cooling the liquid film to a temperature not more than a melting point of the sublimable substance to make the liquid film solidify on the substrate and form a solid film, and a sublimating step of sublimating and thereby removing the solid film from the substrate.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]The present application is a continuation of U.S. patent application Ser. No. 16 / 203,719, filed Nov. 29, 2018, which claims priority to Japanese Patent Application No. 2017-237068, filed Dec. 11, 2017, the contents of both of which are incorporated herein by reference.BACKGROUND OF THE INVENTION1. Field of the Invention[0002]The present invention relates to a substrate processing method and a substrate processing apparatus for processing substrates. Examples of substrates to be processed include substrates, such as semiconductor wafers, substrates for liquid crystal display devices, substrates for FPDs (flat panel displays), such as organic EL (electroluminescence) display devices, etc., substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, substrates for solar cells, etc.2. Description of the Related Art[0003]In substrate processing by a single su...

AI Technical Summary

Benefits of technology

This method achieves satisfactory particle removal and drying of substrate surfaces while preventing pattern collapse and reattachment of particles, enhancing the efficiency of the substrate processing process.

Problems solved by technology

However, with the method described in Japanese Patent Application Publication No. 2014-197717, the particle holding layer is dissolved on the substrate by supplying a dissolving processing liquid to the upper surface of the substrate and therefore particles may fall off from the particle holding layer that is in the process of dissolving and become reattached to the substrate.

The pattern may collapse due to this surface tension.

Pattern collapse tends to occur when the surface tension is high.

Water, which is a typical rinse liquid, is high in surface tension and pattern collapse in the spin drying step thus cannot be ignored.

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