Component-incorporated wiring substrate and method of manufacturing the same

a technology of component-incorporated wiring and wiring substrate, which is applied in the direction of final product manufacturing, sustainable manufacturing/processing, and semiconductor/solid-state device details. it can solve the problems of failure to ensure sufficient connection reliability between the built-in component and the via conductor, increase in dc resistance associated, and reduce the dc resistance associated with the connection between the first via conductor and the terminal electrode. it achieves a wide connection, and reduces the dc resistance resistan

US8952262B2Inactive Publication Date: 2015-02-10NGK SPARK PLUG CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Patents(United States)
Current Assignee / Owner
Publication Date
2015-02-10
Estimated Expiration
Not applicable · inactive patent

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Abstract

A component-incorporated wiring substrate is provided. Some embodiments include a plate-like component incorporated in a core substrate and a build-up layer having an insulation layer and a conductor layer disposed in alternating layers. The component has terminal electrodes formed at its opposite ends having a side surface and a main surface. An insulation layer disposed on the main surface of the component has via conductors formed therein which are connected to the side surfaces and the main surfaces of the respective terminal electrodes. The via conductors are tapered, such that their via diameter decreases in a direction toward the terminal electrode, and their via diameter at a position where they connect to the main surface is greater than a length of the main surface. Accordingly, the area of connection between the via conductors and the corresponding terminal electrodes is increased, improving connection reliability through enhancement of tolerance for positional deviation.
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Description

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] The present application claims priority from Japanese Patent Application No. 2011-189169, which was filed on Aug. 31, 2011, the disclosure of which is herein incorporated by reference in its entirety.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to a wiring substrate having a built-in component (hereinafter referred to as a “component-incorporated wiring substrate”) in which a plate-like component is incorporated.

[0004] 2. Description of Related Art

[0005] A known package is configured as follows: build-up layers are formed on respective opposite sides of a core substrate so as to configure a wiring substrate, and an IC chip or a like device is mounted on the wiring substrate. In recent years, in association with an increase in speed and the number of terminals of IC chips, supply of power to the IC chip mounted on the wiring substrate from an external board involves a problem of malfunction ca...

Examples

Embodiment Construction

[0032]A preferred embodiment of the present invention will next be described with reference to the drawings. However, the embodiment to be described below is a mere example of an application of the technical concept of the present invention. The contents of the embodiment should not be construed as limiting the invention.

[0033]First, the structure of a component-incorporated wiring substrate according to an embodiment of the present invention will be described. FIG. 1 is a schematic sectional view showing the structure of a wiring substrate 10 having a built-in component (hereinafter referred to as “the wiring substrate 10”) of the present embodiment. As shown in FIG. 1, the wiring substrate 10 of the present embodiment includes a core substrate 11 formed from, for example, an epoxy resin which contains glass fiber, a build-up layer 12 on a side toward the upper surface of the core substrate 11, and a build-up layer 13 on a side toward the lower surface of the core substrate 11. The...