Load port apparatus and clamping device to be used for the same

Abstract

To suppress deformation of a portion to be clamped even when a load applied to the portion to be clamped is increased at the time of fixing a front opening unified pod (FOUP), a clamping arm pivotable between a retracting position and a clamping position about a rotational axis inclined relative to a bottom surface of the FOUP is arranged. The clamping arm is housed in a housing depression so that the clamping arm at the retracting position is situated below a surface of a mount base, and at the clamping position, protrudes from the surface of the mount base and becomes engageable with the portion to be clamped.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a so-called front-opening interface mechanical standard (FIMS) system, that is, a load port apparatus, which is used for transferring, from one semiconductor processing apparatus to another semiconductor processing apparatus, wafers held in a sealed-type transport container called a pod, or for transferring the wafers from the semiconductor processing apparatus to the pod, during a semiconductor manufacturing process and the like. Further, the present invention relates to a clamping device to be used for the load port apparatus when fixing the pod onto the load port apparatus.[0003]2. Description of the Related Art[0004]In recent years, in a general semiconductor manufacturing process, cleanliness is managed throughout the entire process by maintaining a highly clean state in only the following three spaces: inner spaces of various processing apparatus; an inner space of a pod capable of...

AI Technical Summary

Benefits of technology

The solution effectively disperses the clamping load, enhancing the rigidity of the pod's clamping surface and preventing deformation, even when securing larger diameter wafers, while maintaining stability and reducing the risk of deformation.

Problems solved by technology

In the aspect of the pod configuration, the increase in thickness of the plate-like part of the portion to be clamped leads to increase in weight of the pod or in size of the configuration of the bottom portion of the pod, and thus it may be difficult to allow such increase in thickness.

However, as described above, the load generated by the clamping portion is also inevitably increased, and hence, in the conventional configuration, the plate-like portion to be clamped may be deformed due to the increased load.

Images