Method and apparatus for identifying integrated circuits

Abstract

An integrated circuit and method for identifying same is described. The integrated circuit includes a programmable identification circuit for storing electronic identification information. The integrated circuit also includes an optical identification mark displaying a machine-readable optical identification code which corresponds with the electronic identification information stored in the identification circuit. The data encoded in the optical identification code may be identical with that of the electronic identification information. Alternatively, a look-up table or other correlating means may be employed to associate the optical identification code with the electronic identification information. The integrated circuit is packaged in a housing, and another optical identification mark is placed on an external surface of the housing. This second optical identification mark displays a machine-readable optical identification code which is identical or correlated to the electronic identification information stored in the identification circuit and / or the optical identification code displayed by the optical identification mark on the integrated circuit. Consequently, convenient and traceable identification of individual integrated circuits is provided during and after manufacture.

Description

TECHNICAL FIELD[0001]This invention relates generally to integrated circuits, and more particularly to identification information for integrated circuits.BACKGROUND OF THE INVENTION[0002]Typically, many identical integrated circuits are constructed on a single wafer of semiconductor material, such as monocrystalline silicon or gallium arsenide. The portion of the wafer occupied by a single one of the integrated circuits is called a die. After completed fabrication of the integrated circuits, a series of tests (known as Probe) is performed in which the function of each die is tested. The test data collected for each die is used in subsequent assembly / packaging steps to ensure that only properly functioning die are packaged as integrated circuit chips.[0003]Following the Probe test, the individual dies are separated from one another, and each properly functioning die is encapsulated (usually in plastic or ceramic) in a package having electric leads to form an integrated circuit chip. ...

AI Technical Summary

Benefits of technology

"The patent describes a method of identifying an integrated circuit by programming it with electronic identification information and marking it with a machine-readable optical identification code. The code can be displayed in various ways, such as on an adhesive label or inscribed with a laser. The integrated circuit can also have multiple programmable links or adapted circuits for non-volatile data storage. The method involves reading the optical identification code and associating it with the electronic identification information using a look-up table or other correlating means. The optical identification code can also encode the same data values as the electronic identification information. The technical effect of this patent is to provide a reliable and efficient way to identify integrated circuits."

Problems solved by technology

For example, when an integrated circuit chip unexpectedly fails during later use, the manufacturer of the chip may wish to identify other potentially failing chips and the users of those chips.

There exist a number of manufacturing process steps during which such physical contact does not occur, and hence traceable identification of the individual integrated circuit chips through the various manufacturing processes is quite difficult.

Also, once the manufacturer ships the integrated circuit chip to a customer, the unique identification information is not readily available.

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