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Elastic surface wave element, elastic surface wave device using same and electronic instrument

A surface acoustic wave and component technology, applied in the direction of electrical components, impedance networks, etc., can solve the problems of large thermoelectricity, difficulty in miniaturization, and inability to form ground potential, so as to achieve resistance to thermoelectric damage, improve the attenuation outside the passband, and prevent Effects of Baseline Raising

Inactive Publication Date: 2007-09-19
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] For the above reasons, it is difficult to achieve further miniaturization in conventional surface acoustic wave devices.
[0014] The second topic is the problem of electrical characteristics
[0018] The third problem is that it is difficult to achieve miniaturization and high reliability
If the disconnection of the resistance occurs, there is no part to avoid the charge excited by the pyroelectric effect, so it is impossible to prevent the discharge destruction of the IDT electrode due to the subsequent temperature change
In addition, Patent Document 2 shows that there is also a problem with the heat resistance of the thin film resistor material itself, and that oxidation rapidly progresses when the temperature rises, and there is a problem with reliability.
[0022] The fourth problem is that the prevention and control effect of the discharge damage of the IDT electrode is not sufficient
Therefore, the thermoelectric excitation on the input and output electrode pads is large and cannot be ignored
In addition, in such a ladder filter, the one-port resonator is constituted by the resonator electrodes, and the electrodes between the resonator electrodes of the signal lines connecting the input pad electrodes and the output pad electrodes cannot be grounded.
That is, the ground electrode cannot be sandwiched between the input pad electrode and the output pad electrode

Method used

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  • Elastic surface wave element, elastic surface wave device using same and electronic instrument
  • Elastic surface wave element, elastic surface wave device using same and electronic instrument
  • Elastic surface wave element, elastic surface wave device using same and electronic instrument

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Embodiment Construction

[0067] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0068] -First electrode shape-

[0069] FIG. 1 is a schematic diagram showing a surface acoustic wave device according to one embodiment of the present invention. FIG. 1( a ) shows a cross-sectional structure, and FIG. 1( b ) shows an electrode structure of a surface acoustic wave device 1 .

[0070] In the surface acoustic wave device of the present invention, the surface acoustic wave element 1 is mounted and arranged via the connection electrode 70 facing one main surface of the circuit board 3 . Furthermore, the surface acoustic wave element 1 is covered with a resin 90 .

[0071] In the surface acoustic wave device 1 , each surface acoustic wave functioning element is formed on one principal surface of a piezoelectric substrate 6 composed of a piezoelectric single crystal such as a lithium tantalate single crystal, a lithium niobate single crystal, or a...

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PUM

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Abstract

Provided is a surface acoustic wave device capable of realizing miniaturization and proper electrical characteristics. A surface acoustic wave element comprises an IDT (Inter-digital Transducer) electrode and a pad electrode formed in one main surface of a piezoelectric substrate and a ring electrode for earth formed in its periphery. In a surface acoustic wave device on which the surface acoustic wave element is mounted in a way the one main surface of the surface acoustic wave element was associated with a circuit substrate, at least one IDT electrode 30b and the ring electrode for earth are integrally formed.

Description

technical field [0001] The present invention relates to a surface acoustic wave device having an IDT electrode formed on one main surface of a piezoelectric substrate. [0002] Furthermore, the present invention relates to a surface acoustic wave device in which the surface acoustic wave element is mounted on a circuit board. [0003] Furthermore, the present invention relates to electronic equipment such as mobile communication equipment such as mobile phones, vehicle-mounted equipment, and medical equipment equipped with a surface acoustic wave device. Background technique [0004] Surface acoustic wave devices such as surface acoustic wave resonators and surface acoustic wave filters are widely used in various mobile communication devices, vehicle-mounted devices, and medical devices using microwave bands. miniaturization. [0005] As a conventional miniaturized surface acoustic wave device, for example, a structure in which a ring-shaped electrode for grounding surroun...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H9/25
Inventor 山形佳史大塚一弘丸田幸一伊藤干尾原郁夫
Owner KYOCERA CORP