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Method for making ferroelectric thin / thick film micro electromechanical refrigerator, its arrangement and refrigerator system

A refrigerator and micro-electromechanical technology, applied in the direction of machine operation, machines using electric/magnetic effects, refrigerators, etc., can solve the problem of inability to realize the integration and miniaturization of MEMS devices and refrigerators, and refrigerators It does not have MEMS integration process compatibility, and it is difficult to realize that MEMS devices share the same substrate, so as to achieve good application universality, good IC process compatibility, and easy integration.

Inactive Publication Date: 2007-12-26
INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Ferroelectric material coolers do not have MEMS integration process compatibility, it is difficult to share the same substrate with MEMS devices, it is impossible to realize the integration and miniaturization of MEMS devices and coolers, and the external electric field is very high (kV level) , it must be connected with MEMS in a hybrid patch assembly method, and the heat conduction efficiency is low

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  • Method for making ferroelectric thin / thick film micro electromechanical refrigerator, its arrangement and refrigerator system
  • Method for making ferroelectric thin / thick film micro electromechanical refrigerator, its arrangement and refrigerator system
  • Method for making ferroelectric thin / thick film micro electromechanical refrigerator, its arrangement and refrigerator system

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Embodiment Construction

[0041] Below in conjunction with accompanying drawing and preferred embodiment, to the preparation method and structure thereof and refrigerator system of ferroelectric thin / thick film microelectromechanical (MEMS) refrigerator that propose according to the present invention, its specific implementation, feature and its Efficacy, detailed as follows.

[0042] The present invention mainly comprises the following two parts:

[0043] 1. Material design and preparation process

[0044] (1) Relaxed Pb(Mg) with high electrothermal (EC) effect and high degree of preferred orientation 1 / 3 Nb 2 / 3 )O 3 with PbTiO 3 Solid solution (PMN-PT), Pb(Sc 1 / 2 Ta 1 / 2 )O 3 with PbTiO 3Solid solution (PST-PT) epitaxial thin film material design and preparation technology.

[0045] Specifically, since the molecular formula stoichiometry ratio, preferred orientation degree and the selection of electrode materials on the substrate will directly affect the epitaxial growth and lattice structure...

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Abstract

The invention relates to a preparation method for a ferroelectric thin / thick film micro electromechanical system (MEMS) refrigerator with novel structure and refrigeration approach and a micro refrigerator system. The preparation method includes preparation process for a PMN-PT and PST-PT relaxational epitaxial ferroelectric thin / thick film as a refrigeration fin and preparation process for a ferroelectric thin / thick film micro MEMS refrigerator array. The micro cooling system can attain high refrigeration efficiency, high heat conduction efficiency and high integration level.

Description

technical field [0001] The present invention relates to the MEMS refrigerator in the microelectromechanical system (MEMS) field of advanced manufacture and automatic technology, particularly relate to the preparation method and structure of a kind of ferroelectric thin / thick film MEMS refrigerator of new structure and micro Refrigerator system, this kind of miniature cooling system is widely used in local cooling of MEMS devices and systems, large scale integrated circuit (LSIC) chips. Background technique [0002] With the development of information technology (IT), micro-electromechanical systems (MEMS) are in the process of further miniaturization, integration and multi-functional development. The contradiction between the high energy density of the power supply (or photoelectric, photothermal, electromagnetic, electrostatic and other excitation methods) is becoming more and more prominent. The MEMS system needs a micro-cooling system to locally cool the chip in order to ...

Claims

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Application Information

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IPC IPC(8): F25B21/00
CPCY02B30/66F25B2400/15Y02B30/00
Inventor 李艳秋刘少波
Owner INST OF ELECTRICAL ENG CHINESE ACAD OF SCI