Support of light emitting diode and preparation method

Abstract

The method includes following steps: (1) circuit board with electrodes is fabricated from organic resin covered metal foil plate through printing circuit technique; (2) making through hole on circuit board; (3) fixing copper piece inside the through hole. The bracket of light emitting diode includes copper piece, circuit board, as well as positive and negative electrodes. Both positive electrode and negative electrode includes face electrode, bottom electrode, and side electrode, which are printed on top, side and bottom surface at end part of the circuit board. The side electrode is connected to the face electrode and bottom electrode. Based on need, circuit board and copper piece in different shapes are easy to be prepared. Thus, outline of bracket is easy to be changed so as to provide good adaptability for subsequent handling, reduce dependability on die set.

Description

【Technical field】 [0001] The invention relates to the field of high-power light-emitting diodes, in particular to a support for high-power light-emitting diodes. 【Background technique】 [0002] The light-emitting diode (also known as LED) bracket is the carrier of the semiconductor light-emitting chip. It undertakes the functions of fixing the chip, connecting the chip with the external circuit, and conducting the heat generated when the chip is working. [0003] figure 1 and figure 2 Disclosed is the first structure of the existing light-emitting diode bracket, which is a composite type of plastic and copper parts. The light-emitting diode bracket includes an electrode 11, a colloid 12 and a copper piece 13. The electrode 11 is located on both sides of the colloid 12 and is integrally injection-molded with the colloid 12. The center of the colloid 12 is provided with a through hole 121, and the copper piece 13 is installed in the through hole. Within 121. The manufactu...

AI Technical Summary

Problems solved by technology

However, this kind of bracket has the following disadvantages: too many molds are used, the investment is large, the precision of the packaging fixture is high, and the subsequent finished product must be molded before it can be used, resulting in troublesome use

However, this kind of bracket has the following disadvantages: 1) Since the edge of the metal plate is a conductor, it is difficult to make side electrodes, so jumpers must be used to connect the LED to the external circuit; Difficult to handle, such as using a copper substrate to make a bracket, the material is expensive

However, this kind of support has the following disadvantages: 1) special molds are required for sintering, and the flexibility of shape change is low; 2) the use of low-cost ceramics has poor thermal conductivity, and the cost of using ceramics with good thermal conductivity is too high

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