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Manufacturing method of metal/insulation layer/metal structure

A metal structure and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as damage to components, and achieve the effect of strengthening the structure and preventing corrosion

Inactive Publication Date: 2008-01-23
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In the subsequent etching process of the upper electrode, the etchant will easily flow down the holes in the insulating layer and etch the metal under the insulating layer, causing damage to the components

Method used

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  • Manufacturing method of metal/insulation layer/metal structure
  • Manufacturing method of metal/insulation layer/metal structure

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Embodiment Construction

[0014] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the preferred embodiments are listed below, together with the accompanying drawings, and are described in detail as follows:

[0015] 1A to FIG. 1D are cross-sectional views illustrating a process of a metal / insulator / metal structure according to a preferred embodiment of the present invention. In this embodiment, a gas annealing treatment is performed on the metal / insulator layer / metal structure, and this method includes the following main steps:

[0016] First, a glass substrate 110 is provided, and a first conductive layer 120 is formed on the glass substrate 110 , as shown in FIG. 1A . The first conductive layer 120 is, for example, aluminum (Al), titanium (Ti), tantalum (Ta), aluminum-silicon-copper (Al-Si-Cu) alloy, tungsten (W), or chromium (Cr). In another embodiment, the first conductive layer 120 may also include multiple sub-layers, such as tw...

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Abstract

A method for manufacturing a metal insulator metal (MIM) structure including the following steps: providing a glass base plate and forming a first conducting layer on it, forming an insulation layer on said first conducting layer, then leading in a gas to anneal the insulation layer and forming a second conduction layer on said insulation layer. Said method further includes, before forming an insulation layer on said first conducting layer a gas is led in to anneal it.

Description

technical field [0001] The present invention relates to a manufacturing method of a metal / insulating layer / metal structure, and in particular to a method for strengthening the insulating layer of the metal / insulating layer / metal structure by means of gas annealing. Background technique [0002] Annealing is a heating process. In this process, the object to be treated is heated to produce the desired physical or chemical change, and only a very small amount of material is added or removed from the surface of the object to be treated. [0003] A conventional metal / insulator / metal structure process is to form an insulating layer on a conductive layer by chemical vapor deposition. Then, a laser annealing process is used to strengthen the insulating layer, but it is not easy to control the uniformity of the laser, so it is less valuable for mass production. [0004] Another conventional metal / insulator / metal structure process is a wet process and uses chemical vapor deposition ...

Claims

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Application Information

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IPC IPC(8): H01L21/02H01L21/3105H01L45/00
Inventor 李豪捷
Owner AU OPTRONICS CORP
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