Manufacturing method of metal/insulation layer/metal structure
A metal structure and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as damage to components, and achieve the effect of strengthening the structure and preventing corrosion
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[0014] In order to make the purpose, features, and advantages of the present invention more obvious and understandable, the following is a detailed description of preferred embodiments, in conjunction with the accompanying drawings, as follows:
[0015] FIGS. 1A to 1D are cross-sectional views illustrating the manufacturing process of a metal / insulating layer / metal structure according to a preferred embodiment of the present invention. In this embodiment, a gas annealing process is performed on the metal / insulating layer / metal structure. The method includes the following main steps:
[0016] First, a glass substrate 110 is provided, and a first conductive layer 120 is formed on the glass substrate 110, as shown in FIG. 1A. The first conductive layer 120 is, for example, aluminum (Al), titanium (Ti), tantalum (Ta), aluminum-silicon-copper (Al-Si-Cu) alloy, tungsten (W), or chromium (Cr). In another embodiment, the first conductive layer 120 may also include multiple sub-layers, suc...
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