X-ray coating thickness device
A technology of X-ray and coating thickness, used in instruments, scientific instruments, using wave/particle radiation, etc., can solve problems such as equations that cannot be solved simultaneously or unstable calculation results, impossible measurement, and reduced intensity
Inactive Publication Date: 2008-08-06
HITACHI HIGH TECH SCI CORP
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Problems solved by technology
When the thickness of the alloy coating increases, the intensity of Cu-K X-rays emitted from the copper within the alloy coating increases, but due to the absorption of the coating, the intensity of Cu-K X-rays emitted from the copper material decreases conversely
Therefore, even if a continuous standard surrogate group could be measured, measurement is not possible; even if the parameters can be determined, the parameters used in the relationship cannot be determined, so the simultaneous equations cannot be solved or the calculation results are unstable
Method used
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[0024] Below is the reference figure 1 with figure 2 A description of a preferred embodiment of the invention.
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In order to provide an X-ray coating thickness gauge capable of simultaneously measuring plating thickness and copper concentration of a tin alloy plating layer on a material constituted by one or more layers including copper, the copper concentration of a tin alloy plating layer is determined using the intensity of peaks caused by diffracted X-rays in acquired X-ray spectra information.
Description
technical field [0001] The present invention relates to an X-ray coating thickness meter for simultaneously detecting the thickness and composition of multi-layer samples in a non-destructive manner, and more particularly relates to an X-ray coating thickness meter when the sample to be tested is a tin-copper alloy set on a copper alloy material It is an X-ray coating thickness meter that detects the thickness and copper concentration of the alloy coating without being affected by the material itself during the coating. Background technique [0002] For example, fluorescent X-ray thickness measurement is well known and widely used in the detection of solder thickness and composition, which employs an X-ray generator and an energy-distributive X-ray detector to obtain a multilayer sample with layer thickness and alloy composition. Fluorescent X-rays are obtained in the process, and then the calibration curve method or theoretical calculation method is used to measure the fluo...
Claims
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IPC IPC(8): G01N23/223G01B15/02C25D7/00C25D21/12G01N23/20G01N23/207
CPCG01N23/20
Inventor 田村浩一
Owner HITACHI HIGH TECH SCI CORP