Substrate processing method and substrate processing apparatus

Abstract

The present invention provides a substrate processing method and a substrate processing apparatus capable of securing a sufficient cleaning function while reducing damage caused on a substrate surface during cleaning. A substrate processing apparatus is provided with long brushes (221) respectively having a bristle bundle composed of a large number of bristles; a transfer roller for transferring a substrate (B) to the brushes (221) in an intersecting direction with an extending direction of the brushes (221); a support mechanism which supports each brush (221) in a state that the tip (50H) of the brush bristle bundle (50) of each brush (221) is directed at the downstream side, in the transfer direction of the substrate (B) transferred by the transfer roller, and also, in a state that the side (50F) of the brush bristle bundle (50) of each brush (221) is brought into contact with the upper face of the substrate (B); and processing liquid supply nozzles (231) for respectively supplying a processing liquid to the brush bristle bundle (50) of each brush (221) supported by the support mechanism.

Description

technical field [0001] The present invention relates to various processes, such as cleaning, of glass substrates for LCDs or PDPs, semiconductor substrates, printed substrates, etc., in the manufacturing process of liquid crystal display devices (LCD), plasma display devices (PDP), and semiconductor devices Substrate processing method and substrate processing apparatus. Background technique [0002] In recent years, on substrate manufacturing lines such as glass substrates for LCDs or PDPs, for example, a substrate cleaning mechanism is installed after a specific processing device that uses a chemical solution to perform substrate processing such as etching, and cleans and removes residues on the substrate surface. Films, particles and other foreign matter. For example, as shown in Patent Document 1, as a substrate processing apparatus having such a substrate cleaning mechanism, there has been proposed a device that supplies a processing liquid such as pure water to a subst...

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Problems solved by technology

[0006] However, the substrate processing apparatus shown in the above-mentioned Patent Document 1 rotates the roller brush to clean the substrate. etc.), the metal film may be damaged

[0007] In addition, even in the cleaning device shown in Patent Document 2, the cleaning brush is reciprocated in the direction perpendicular to the substrate conveyance direction while in contact with the substrate surface. When the surface of the substrate is exposed, it may cause damage to the metal film

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