Mirror device, mirror array, optical switch, and manufacturing method thereof
A mirror and device technology, applied in piezoelectric devices/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, optics, etc., can solve problems such as discharge, prevent damage and increase elevation difference , the effect of large rotation angle
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 approach
[0147] The mirror device 1 according to the first embodiment will be described below. As shown in FIGS. 1 and 2, an insulating layer 102 made of a silicon oxide film is formed on a lower substrate 101 of single crystal silicon. Four driving electrodes 103 - 1 to 103 - 4 are disposed on the insulating layer 102 at the center of the lower substrate 101 . Single crystal silicon pillars 104 are disposed on both sides of the upper surface of the lower substrate 101 .
[0148] In this embodiment, the insulating layer 102 on the surface of each pillar 104 is partially removed to form the contact hole 106 . A metal layer 105 made of, for example, Au is formed on the contact hole 106 .
[0149] There is an annular universal bracket 152 inside the upper base plate 151 . The reflector 153 is disposed within the gimbal 152 . For example, Ti / Pt / Au (not shown) having a three-layer structure is formed on the upper surface of the reflection mirror 153 . Torsion springs 154 connect the up...
no. 2 approach
[0167] Next, a second embodiment of the present invention will be described with reference to FIG. 4 . The same reference numerals as in FIGS. 1 and 2 denote the same parts in FIG. 4 . In the first embodiment, the second potential is applied to the metal layer 156 through the lower substrate 101 and the pillars 104 made of single crystal silicon. On the contrary, as shown in FIG. 4 , the second potential can be applied to the metal layer 156 through the metal pillar 107 formed on the insulating layer 102 . To form the pillars 107, a metal such as Au is deposited, for example by electroplating. In the second embodiment, since it is possible to secure electrical connection with the metal layer 156 without interfering with the silicon layer, the potential of the lower surface of the reflection mirror 153 can be appropriately set.
no. 3 approach
[0169] Next, a third embodiment of the present invention will be described with reference to FIG. 5 . The same reference numerals as in FIGS. 1 and 2 denote the same parts in FIG. 5 . In the first embodiment, the second potential is applied to the metal layer 156 through the lower substrate 101 and the pillars 104 made of single crystal silicon. On the contrary, as shown in FIG. 5 , the insulating layer 102 on the lower substrate 101 may be partially removed to form a contact hole 109 . A pillar 108 made of, for example, Au may be formed on the contact hole 109 so that the second potential is applied to the metal layer 156 through the pillar 108 . This facilitates the electrical connections to the struts 108 .
[0170] In the first to third embodiments, in order to obtain a reliable electrical connection with the metal layer 156 , for example, an oxide film on the surface of the metal layer 105 or 156 or the pillars 107 and 108 may be removed by acid. Not only mechanical co...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More