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Method for producing image-pickup assembly and camera module

A manufacturing method and image capture technology, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, image communication, etc., can solve problems such as increasing production costs and risks, and increasing product production schedules.

Inactive Publication Date: 2009-01-21
MACRONIX INT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, different PCBs must be designed and produced for each production order, resulting in an increase in product production schedule
For the electronics industry that attaches great importance to time cost, this is tantamount to increasing a lot of production costs and risks

Method used

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  • Method for producing image-pickup assembly and camera module
  • Method for producing image-pickup assembly and camera module
  • Method for producing image-pickup assembly and camera module

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0016] Please refer to figure 1 , which shows a flow chart of a method for manufacturing a camera module according to a preferred embodiment of the present invention. First, please also refer to Figure 2A and Figure 2B , which respectively depict the top view and the bottom view of the circuit board of the preferred embodiment of the present invention. As shown in step 110, a circuit board 200 is provided. The circuit board 200 has a surface 201 and a back surface 202, and the surface 201 has a plurality of upper pads; in this embodiment, the first row of upper pads 210 and the second row of upper pads 220 parallel to each other are taken as an example on the surface 201 For explanation, but the embodiments of the present invention are not limited thereto. The back side 202 has the first row of lower pads 230 and the second row of lower pads 240 arranged in parallel, and the first row of lower pads 250 and the second row of lower pads 260 arranged in parallel, the first ...

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PUM

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Abstract

The invention is concerned with the production for image gathering module. Produce circuit board with surface and back and the surface owning with some upside gaskets. The back has the first column and second column down gaskets in parallelly, and the first list and second list down gaskets in parallel, while the first column and list are vertical arrangement one another. the part of upside gaskets are coupling with the first column and the first list down gaskets, while the other upside gaskets are coupling with the second column and the second list down gaskets. Set sensitive chip with some chip gaskets on the surface, connect gasket with chip gasket by line, and set sustaining module for lens on the surface of circuit board to form the image gathering module.

Description

(1) Technical field [0001] The present invention relates to a method for manufacturing an image capture component and a camera module, and in particular to a method for manufacturing a standardized image capture component to further process and complete a camera module in response to different customer requirements. (2) Background technology [0002] Due to the advancement of semiconductor manufacturing process and packaging technology, the size of the chip is shrinking day by day, but the function is getting stronger and stronger, which also drives the trend of consumer electronics products in recent years. The digital camera came out a few years ago, and now the low-end digital camera has been gradually replaced by the camera module on the personal digital assistant (PDA) and mobile phone. At present, the camera function has been gradually listed as a basic function of the above-mentioned consumer electronic products, which has also led to a large demand for camera modules...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H01L27/146H01L23/498H04N5/225
CPCH01L2224/48091H01L2224/48227H01L2924/00014
Inventor 张景贤陈良鉴陈正裕黄新江李睿中
Owner MACRONIX INT CO LTD