Resistor
A technology of resistors and resistors, applied in resistors, non-adjustable metal resistors, circuits, etc., can solve the problem that lead-free resistors such as chip-type fixed resistors are not practical.
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[0053]As a specific manufacturing example, first mix ruthenium oxide and bismuth ruthenate with an average particle diameter of 2 μm or less, or conductive fine powders other than the above, glass frit with an average particle diameter of 5 μm or less, and a TCR adjuster in a set ratio, and add Organic vehicle, pre-mixed with a strong mixer such as a kneader. Next, this mixture was transferred to a three-roll mill and kneaded at normal temperature to obtain a paste. In addition, in order to make the paste reach the desired viscosity, it is carried out by adding an organic vehicle or adding an organic solvent such as terpineol or diethylene glycol monobutyl ether during kneading in a three-roll mill.
[0054] The mixing ratio of the conductive fine powder and the glass frit is determined according to the resistance value required for the thick film resistor layer provided by printing or the like. That is, when aiming at a low-resistance thick-film resistor paste, reduce the bl...
Embodiment 1
[0060] Fully knead ruthenium oxide (RuO 2 ) 1.26 parts by weight, bismuth ruthenate (Bi 2 Ru 2 o 7 ) 0.84 parts by weight, bismuth glass frit (Bi 2 o 3 15% by weight, SiO 2 25% by weight, BaO 35% by weight, ZnO 5% by weight, Al 2 o 3 7% by weight, B 2 o 3 3% by weight) and 4.9 parts by weight of an organic vehicle (terpineol solution of 8% ethylcellulose) 4.5 parts by weight to obtain a thick film resistor paste. Screen-print the above paste on the pre-printed electrode (Ag electrode prepared by using the above-mentioned bismuth-based glass frit) and finger-touch dry alumina substrate to form a pattern with a width of 2mm and a length of 6mm, and dry it at 120°C for 15 minutes Thereafter, firing was performed for 30 minutes in a continuous electric furnace set at a peak temperature of 850° C. for 10 minutes. After cooling, a glass layer made of the above-mentioned bismuth-based glass frit was placed on the surface of the thick-film resistor layer provided above, ...
Embodiment 2
[0063] Fully knead ruthenium oxide (RuO 2 ) 1.26 parts by weight, bismuth ruthenate (Bi 2 Ru 2 o 7 ) 0.84 parts by weight, bismuth glass frit (Bi 2 o 3 25% by weight, SiO 2 29% by weight, BaO 31% by weight, ZnO 6% by weight, Al 2 o 3 6% by weight, B 2 o 3 0.5% by weight) 4.9 parts by weight, and 4.5 parts by weight of an organic vehicle (terpineol solution of 8% ethyl cellulose) to obtain a thick-film resistor paste. Screen-print the above paste on the pre-printed electrode (Ag electrode prepared by using the above-mentioned bismuth-based glass frit) and finger-touch dry alumina substrate to form a pattern with a width of 2mm and a length of 6mm, and dry it at 120°C for 15 minutes Thereafter, firing was performed for 30 minutes in a continuous electric furnace set at a peak temperature of 850° C. for 10 minutes. After cooling, a glass layer made of the above-mentioned bismuth-based glass frit was placed on the surface of the thick-film resistor layer provided abo...
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