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Resistor

A technology of resistors and resistors, applied in resistors, non-adjustable metal resistors, circuits, etc., can solve the problem that lead-free resistors such as chip-type fixed resistors are not practical.

Inactive Publication Date: 2009-02-18
KOJIMA CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] It has been about 7 years since the introduction of lead-free solder, but lead-free resistors such as chip-type fixed resistors have not yet reached practical use

Method used

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manufacture example

[0053]As a specific manufacturing example, first mix ruthenium oxide and bismuth ruthenate with an average particle diameter of 2 μm or less, or conductive fine powders other than the above, glass frit with an average particle diameter of 5 μm or less, and a TCR adjuster in a set ratio, and add Organic vehicle, pre-mixed with a strong mixer such as a kneader. Next, this mixture was transferred to a three-roll mill and kneaded at normal temperature to obtain a paste. In addition, in order to make the paste reach the desired viscosity, it is carried out by adding an organic vehicle or adding an organic solvent such as terpineol or diethylene glycol monobutyl ether during kneading in a three-roll mill.

[0054] The mixing ratio of the conductive fine powder and the glass frit is determined according to the resistance value required for the thick film resistor layer provided by printing or the like. That is, when aiming at a low-resistance thick-film resistor paste, reduce the bl...

Embodiment 1

[0060] Fully knead ruthenium oxide (RuO 2 ) 1.26 parts by weight, bismuth ruthenate (Bi 2 Ru 2 o 7 ) 0.84 parts by weight, bismuth glass frit (Bi 2 o 3 15% by weight, SiO 2 25% by weight, BaO 35% by weight, ZnO 5% by weight, Al 2 o 3 7% by weight, B 2 o 3 3% by weight) and 4.9 parts by weight of an organic vehicle (terpineol solution of 8% ethylcellulose) 4.5 parts by weight to obtain a thick film resistor paste. Screen-print the above paste on the pre-printed electrode (Ag electrode prepared by using the above-mentioned bismuth-based glass frit) and finger-touch dry alumina substrate to form a pattern with a width of 2mm and a length of 6mm, and dry it at 120°C for 15 minutes Thereafter, firing was performed for 30 minutes in a continuous electric furnace set at a peak temperature of 850° C. for 10 minutes. After cooling, a glass layer made of the above-mentioned bismuth-based glass frit was placed on the surface of the thick-film resistor layer provided above, ...

Embodiment 2

[0063] Fully knead ruthenium oxide (RuO 2 ) 1.26 parts by weight, bismuth ruthenate (Bi 2 Ru 2 o 7 ) 0.84 parts by weight, bismuth glass frit (Bi 2 o 3 25% by weight, SiO 2 29% by weight, BaO 31% by weight, ZnO 6% by weight, Al 2 o 3 6% by weight, B 2 o 3 0.5% by weight) 4.9 parts by weight, and 4.5 parts by weight of an organic vehicle (terpineol solution of 8% ethyl cellulose) to obtain a thick-film resistor paste. Screen-print the above paste on the pre-printed electrode (Ag electrode prepared by using the above-mentioned bismuth-based glass frit) and finger-touch dry alumina substrate to form a pattern with a width of 2mm and a length of 6mm, and dry it at 120°C for 15 minutes Thereafter, firing was performed for 30 minutes in a continuous electric furnace set at a peak temperature of 850° C. for 10 minutes. After cooling, a glass layer made of the above-mentioned bismuth-based glass frit was placed on the surface of the thick-film resistor layer provided abo...

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Abstract

A resistor of excellent acid resistance that enables one-time simultaneous firing of three layers of electrode part, resistance element part and surface coat part and contributes toward global environment is obtained by nonleading a thick-film resistance element paste for resistor. In particular, a resistor provided with substrate (1), resistance element (3), electrode (2) connected to the resistance element (3) and precoat (4) covering the resistance element (3) is produced by using in the formation of resistance element a thick-film resistance element paste comprising, as main components, conductive powder, glass frit and an organic vehicle wherein the glass frit is composed of, in terms of weight ratio, 1% or less of an alkali metal, 10 to 30% of Bi2O3, 25 to 40% of SiO2, 30 to 40% of BaO, 5 to 7% of ZnO, 4 to 7% of Al2O3 and 0.01 to 8% of B2O3 and does not contain PbO.

Description

technical field [0001] The present invention relates to the use of screen printing technology to print and burn the set pattern on the ceramic substrate through resistor body paste, conductive paste and pre-coating layer to form a printed thick film resistor, especially involving the use of acid-resistant Thick-film resistor paste, conductive paste, and pre-coated resistors using lead-free bismuth-based glass with excellent performance as glass frit. Background technique [0002] The commonly used thick film resistor paste is RuO 2 , pyrochlore-type lead ruthenate (Pb 2 Ru 2 o 7-x ) and other conductive micropowders and glass frit (glass frit) are mixed with an organic vehicle, and mixed and prepared by a three-roll rolling mill. Pyrochlore lead ruthenate and RuO 2 Ratio, the temperature coefficient of resistance (TCR) is small, and RuO is used alone and in a small amount 2 Occasionally, the resistance value is unstable, and RuO 2 Simultaneously using the pyrochlore-t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/00H01B1/22C04B41/86C03C8/04
Inventor 西野敦进藤泰宏须藤泰博岩崎正雄
Owner KOJIMA CHEM CO LTD