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Vacuum processing device

A technology for a vacuum processing device and a vacuum processing chamber, which is used in transportation and packaging, conveyor objects, electrical components, etc., and can solve problems such as the adverse effects of processing substrates being processed, and the inability to fully ensure the airtightness of the load lock chamber and the vacuum processing chamber. , to achieve the effect of reliable removal

Inactive Publication Date: 2009-02-18
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] As described above, if the airtightness of the load lock chamber and the vacuum processing chamber cannot be sufficiently secured, air containing moisture may enter the vacuum processing chamber from the load lock chamber side, which may adversely affect the processing of the substrate to be processed.

Method used

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  • Vacuum processing device
  • Vacuum processing device
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Embodiment Construction

[0057] Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.

[0058] figure 1 It is a perspective view showing a schematic structure of a vacuum processing apparatus 100 according to an embodiment of the present invention, and FIG. 2 shows figure 1 A horizontal cross-sectional view of the main part of the vacuum processing apparatus 100. The vacuum processing apparatus 100 has a vacuum processing chamber 10 for performing desired vacuum processing such as plasma etching processing or thin film forming processing in a vacuum atmosphere on a substrate G such as a transparent LCD glass substrate; Load lock chamber 20 serving as a vacuum preparation chamber; gate valves 30a, 30b double-installed between vacuum processing chamber 10 and load lock chamber 20;

[0059] As shown in FIG. 2 , a vacuum pump 60 as an exhaust unit is connected to the vacuum processing chamber 10 through an exhaust control valve 61 , and exhaus...

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Abstract

Provided is a vacuum processing device which can prevent mixing of moisture into a vacuum processing chamber certainly. Gate valves 30a and 30b having valve elements 31a and 31b, respectively, are arranged doubly between a vacuum processing chamber 10 and a load lock chamber 20. The load lock chamber 20 is connected with three exhaust pipes 21, 22 and 23 having different conductances which are connected with a vacuum pump 60 through open / close valves 62, 63 and 64, respectively. An N2gas supply 26 for introducing N2gas into the load lock chamber 20 is also connected.

Description

technical field [0001] The present invention relates to vacuum processing technology, and in particular, to a vacuum processing device that can perform vacuum processing such as dry etching on glass substrates for FPDs (flat panel displays) typified by liquid crystal displays (LCDs) and plasma displays. technology used. Background technique [0002] For example, in the LCD manufacturing process, dry etching or sputtering, CVD (Chemical Vapor Growth) and other vacuum treatments are often used on the LCD glass as the substrate to be processed. [0003] In the vacuum processing apparatus for performing such vacuum processing, a vacuum preparation chamber adjacent to the vacuum processing chamber (processing module) that maintains the vacuum and performs the above-mentioned processing is provided, so that when the substrate to be processed is carried in and out, the atmosphere in the vacuum processing chamber Little change. [0004] Specifically, for example, a load-lock chamb...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/677
CPCH01L21/67017H01L21/67126H01L21/67772
Inventor 志村昭彦近藤裕志锅山裕树
Owner TOKYO ELECTRON LTD