Manufacture method for diode light-emitting device and structure thereof
A technology for a light-emitting device and a manufacturing method, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, and electric solid-state devices, etc., can solve the problems of low heat dissipation efficiency of the packaging structure and complicated manufacturing process, and achieves increased air tightness and heat dissipation efficiency. , the effect of good heat dissipation efficiency
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[0090] In order to further illustrate the purpose, structural features and functions of the present invention, the detailed descriptions are as follows in conjunction with relevant embodiments and accompanying drawings:
[0091] The present invention is a method for manufacturing a diode light-emitting device 30 and its structure, wherein the structure of the diode light-emitting device 30 is to use a metal material with good thermal conductivity to manufacture the body 41 of the diode light-emitting device 30 to greatly increase the heat dissipation area, so that The diode chip 50 of the diode light emitting device 30 can obtain a better heat dissipation effect during operation.
[0092] figure 2 Shown is a stereoscopic implementation diagram of a diode light emitting device 30 of the present invention. image 3 shown, for a along figure 2 A cross-sectional implementation diagram of a diode light-emitting device 30 of the present invention on the line A-A. The diode ligh...
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