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Epoxy resin binder as well as preparation method and application thereof

A technology of epoxy resin and adhesive, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., to achieve the effect of solving the problem of temperature resistance

Pending Publication Date: 2022-03-18
SHANDONG RES & DESIGN ACADEMY OF IND CERAMICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above problems, the present invention provides an epoxy resin adhesive and its preparation method and application. The adhesive strength of the epoxy resin adhesive is above 25 MPa at room temperature, and the adhesive strength of the epoxy resin adhesive is above 12 MPa at 200°C for 10 minutes. , 280°C for 10 minutes, the bonding strength is above 6MPa, which can solve the temperature resistance problem of epoxy resin adhesives at temperatures above 250°C for a short period of time

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] This embodiment provides an epoxy resin adhesive, which is obtained by mixing and curing component A and component B; the component A includes 100 parts by weight of E-44 type epoxy resin, barium phenolic resin 30 parts of resin, 9 parts of resorcinol, 4 parts of 203 polyether, 6 parts of nitrile rubber, 15 parts of nano-titanium dioxide, 12 parts of silicon micropowder with D50 particle size of 50 μm, 1.5 parts of fumed white carbon black, KH550 silane coupling 2 parts of agent; the B component includes 6 parts of 2-ethyl-4-methylimidazole and hexamethylenetetramine in a weight ratio of 6:1.5.

[0023] This embodiment also provides a method for preparing the above-mentioned epoxy resin adhesive, which includes the following steps: Grinding the above-mentioned component A through a three-roll grinder for 3 times, and the gap between the rolls is 0.25mm; 0.15mm; 0.08mm Preheat the ground component A at 75°C for 20 minutes; mix the preheated component A and the B componen...

Embodiment 2

[0026] This embodiment provides an epoxy resin adhesive, which is obtained by mixing and curing component A and component B; the component A includes 100 parts by weight of E-51 type epoxy resin, barium phenolic resin 40 parts of resin, 14 parts of resorcinol, 4 parts of 303 polyether, 12 parts of nitrile rubber, 10 parts of nano titanium dioxide, 5 parts of silicon micropowder, 2.5 parts of fumed white carbon black, 1 part of KH560 silane coupling agent; Component B includes 2-methylimidazole and hexamethylenetetramine in a weight ratio of 12:2.5.

[0027] This embodiment also provides a method for preparing the above-mentioned epoxy resin adhesive, which includes the following steps: Grinding the above-mentioned component A through a three-roll grinder for 3 times, and the gap between the rolls is 0.3mm; 0.2mm; 0.1mm ; Preheat the ground component A at 80°C for 15 minutes; mix the preheated component A and the B component in a weight ratio of 100:30, then heat at 100°C for 1...

Embodiment 3

[0030]This embodiment provides an epoxy resin adhesive, which is obtained by mixing and curing component A and component B; the component A includes 100 parts by weight of E-44 type epoxy resin, barium phenolic resin 18 parts of resin, 5.5 parts of resorcinol, 0.5 part of 403 polyether, 3 parts of nitrile rubber, 25 parts of nano-titanium dioxide, 20 parts of silicon micropowder with D50 particle size of 30 μm, 0.5 part of fumed white carbon black, KH570 silane coupling 2 parts of agent; the B component includes 2-phenylimidazole and hexamethylenetetramine in a weight ratio of 2:0.2.

[0031] This embodiment also provides a method for preparing the above-mentioned epoxy resin adhesive, which includes the following steps: Grinding the above-mentioned component A through a three-roll grinder for 3 times, and the gap between the rolls is 0.2mm; 0.15mm; 0.05mm ; Preheat the ground component A at 60°C for 30 minutes; mix the preheated component A and the B component in a weight rat...

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Abstract

The invention discloses an epoxy resin binder as well as a preparation method and application thereof. The epoxy resin binder is obtained by mixing and curing a component A and a component B, the component A is prepared from the following components in parts by weight: 100 parts of epoxy resin, 18 to 40 parts of phenolic resin, 5.5 to 14 parts of resorcinol, 3.5 to 16.5 parts of toughening agent, 15 to 45 parts of inorganic modified filler and 0.5 to 2.5 parts of reinforcing agent; the component B comprises a first curing agent and a second curing agent, and the weight ratio of the first curing agent to the second curing agent is (2-12): (0.5-2.5). The bonding strength of the epoxy resin adhesive at normal temperature is 25 MPa or above, the bonding strength is 12 MPa or above after the epoxy resin adhesive is kept at 200 DEG C for 10 minutes, the bonding strength is 6 MPa or above after the epoxy resin adhesive is kept at 280 DEG C for 10 minutes, and the problem of temperature resistance of the epoxy resin adhesive at the temperature of 250 DEG C or above within a short time can be solved.

Description

technical field [0001] The invention belongs to the field of adhesives, and in particular relates to an epoxy resin adhesive and its preparation method and application. Background technique [0002] Compared with other material adhesives, epoxy resin adhesive has higher bonding strength, the bonding strength can be greater than 20MPa at room temperature, the curing shrinkage is smaller, and the aging resistance is better. It is more suitable for the bonding of quartz composite materials and metal materials. catch. [0003] However, the high temperature resistance of conventional epoxy resin adhesives is insufficient, and the adhesive strength decays to 5 MPa or less at 200°C. Now, the application field of quartz-quartz composite radome has reached nearly 300 °C, and the bonding strength at 200 °C must meet more than 10 MPa. The existing epoxy resin adhesive can no longer meet the demand. Contents of the invention [0004] In view of the above problems, the present invent...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/08C09J11/06
CPCC09J163/00C09J11/04C09J11/08C09J11/06C08K2003/2241C08L2201/08C08L9/02C08L71/00C08K3/22C08K3/36C08K7/26C08K5/544
Inventor 曹俊倡杨显锋栾强王洪升邢政鹏崔唐茵陈东杰
Owner SHANDONG RES & DESIGN ACADEMY OF IND CERAMICS
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