Laser processing method
A laser processing method and technology for processing objects, applied in metal processing, stone processing equipment, laser welding equipment, etc.
Active Publication Date: 2009-06-10
HAMAMATSU PHOTONICS KK
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[0008] In this way, it can be said that when the object to be processed is cut into a grid pattern by forming the modified region in the above-mentioned order, there is still room for improvement in the cutting accuracy.
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[0066] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the laser processing method of the present embodiment, a phenomenon called multiphoton absorption is utilized in order to form a modified region inside the object to be processed. Therefore, first, a laser processing method for forming a modified region using multiphoton absorption will be described.
[0067] The band gap (band gap) E G When it is still young, it becomes optically transparent. Therefore, the condition for absorption on the material is hv>E G . However, even if it is optically transparent, if the intensity of the laser is increased very much, then at nhv>E G Absorption occurs on the material under the conditions (n=2, 3, 4, ...). This phenomenon is called multiphoton absorption. In the case of pulsed waves, the intensity of the laser is determined by the peak power density (W / cm 2 ) determined, for example, at a peak power den...
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Abstract
A laser processing method by which an object to be processed can be cut with a high precision is provided. The laser processing method of the present invention irradiates a planar object to be processed 1 with laser light L while locating a light-converging point P within the object 1. Initially, a first modified region 71 to become a start point for cutting is formed along a first line to cut 5a in the object 1. Subsequently, along a second line to cut 5b intersecting the line to cut 5a, a second modified region 72 to become a start point for cutting is formed so as to intersect at least a part of the modified region 71. Then, a fourth modified region 73 to become a start point for cutting is formed along the line to cut 5b. Thereafter, between the modified region 71 and an entrance face 1a of the object 1 where the laser light L is incident, a third modified region 74 to become a start point for cutting is formed along the line to cut 5a so as to intersect at least a part of the modified region 73.
Description
technical field [0001] The present invention relates to a laser processing method used for cutting a plate-shaped object to be processed. Background technique [0002] In the prior art of this kind, there is a laser processing method in which a modified region along a line to be cut is formed inside the object to be processed by aligning a focal point with the inside of the object to be processed and irradiating laser light. multiple rows, and the modified region is used as the starting point of cutting (for example, refer to Patent Document 1). [0003] Patent Document 1: Japanese Patent Laid-Open No. 2002-205180 [0004] In the case of cutting a plate-shaped object into a lattice using the above-mentioned laser processing method, for example, as Figure 20 (A) and Figure 20 As shown in (B), a modified region is formed inside the object to be processed. Figure 20 (A) and Figure 20 (B) is a schematic diagram for explaining an example of the procedure for forming modified...
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IPC IPC(8): B23K26/40B23K26/00B23K26/06B28D5/00B23K26/064B23K26/38
CPCB23K26/38B23K26/0057B23K26/4075B23K2201/40B23K26/40B23K26/53B23K2101/40B23K2103/50B23K26/06
Inventor 坂本刚志
Owner HAMAMATSU PHOTONICS KK