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Manufacture of fine-grained electroplating anodes

A technology of anode and average grain size, applied in electrodes, electrolytic components, electrolytic processes, etc., can solve problems such as unacceptable products, large amounts of waste, expensive technology, etc.

Inactive Publication Date: 2009-07-01
BRUSH WELLMAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, these techniques can be very expensive
Additionally, conventional cold working equipment does not achieve uniform grain size reduction over segment thicknesses of about 3 inches or more
In addition, cracks and other defects often occur during cold working, resulting in significant scrap and / or unacceptable product
Therefore, practically, conventional manufacturing processes cannot consistently and reliably achieve average grain sizes as small as 200 μm in copper rods and tubes with diameters of 200 mm or more

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example

[0042] In order to describe the present invention in more detail, the following processing examples are provided.

example 1

[0044] A cylindrical ingot of alloy C12220 (copper 99.9% minimum, phosphorus 0.040 to 0.065%), 17 inches in diameter, by the turbulent flow casting procedure described above and in U.S. Patents 4,315,538 and 5,279,353 noted above manufacture.

[0045] After cooling to room temperature, the billet so formed was heated to 1100°F and forward extruded to a diameter of 8.25 inches (21 cm). The hot-worked billet was then sawn into anode billet lengths of 1 3 / 8 inches (3.5 cm), with the average grain size of the billet determined in accordance with ASTM E-112. The average grain size of the thus produced anode blank was determined to be 54 μm to 150 μm.

example 2

[0047] Example 1 was repeated except that a 5.0 inch (12.7 cm) hole was drilled through the center of the billet, and then the billet was extruded to form a tube with an outside diameter of 9.5 inches (24.1 cm) and an inside diameter of 4.8 cm. inches (12.2cm). In addition, the tube was divided into anode billets 2.5 inches (6.4 cm) in length. The average grain size of the thus formed anode blank was 15 μm to 90 μm.

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PUM

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Abstract

A continuously cast copper ingot is made by a procedure in which turbulence is imparted to the metal / solid interface during the casting operation. The ingot is then hot worked to form a billet having a smaller average grain size and a larger diameter than possible in the past. The billet is especially useful for making electroplating anodes used in the damascene process for making copper interconnects in silicon wafers.

Description

technical field [0001] The present invention relates to the fabrication of fine-grained electroplating anodes, especially copper interconnects for the production of silicon semiconductor chips. Background technique [0002] Copper interconnects within multilayer silicon wafers and semiconductor chips are typically made by a damascene process. This process is described in US Patents 4,789,648 and 5,539,255, the disclosures of which are incorporated herein by reference. [0003] In this process, copper is selectively electrodeposited onto a silicon wafer from an electroplating anode made of copper or a copper alloy. Prior to electrodeposition, an intricate pattern of trenches is etched into the wafer to define the interconnections to be formed. Then, the anode is mounted close to the wafer but not in contact with the wafer. Both are submerged in an electrolytic bath where copper from the anode is electrodeposited on the wafer. [0004] Typical electroplating anodes for the...

Claims

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Application Information

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IPC IPC(8): B22D11/10B22D11/12B22D11/00C25D17/12C22C1/04B22F3/14C22C9/00C22C1/00B21B3/00B21B1/02B22D7/00C22F1/08C25D17/10
CPCC25D17/10B22D7/005C22F1/08Y10T29/49988Y10T29/49975Y10T29/49991Y10T29/49973C25B11/042
Inventor W·J·比肖普
Owner BRUSH WELLMAN