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Light source module

A technology for light source components and light-emitting chips, which is applied to light sources, point light sources, semiconductor devices of light-emitting elements, etc., can solve the problems of large size and increased cost of lamps, and achieve improved heat dissipation efficiency, long service life, and convenient assembly and rework. Effect

Inactive Publication Date: 2009-07-08
CHIPMOS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The existing technology uses a complex heat dissipation system, but the complex heat dissipation system will also cause problems such as excessive volume of the lamp and increased cost

Method used

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  • Light source module
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Embodiment Construction

[0021] figure 1 2 is a top view of a light source assembly according to an embodiment of the present invention, and 2 is a cross-sectional view of a light source assembly according to an embodiment of the present invention. Please refer to figure 1 and figure 2 The light source assembly 100 of this embodiment includes a first heat dissipation plate 110 , a partition wall 120 and a plurality of light emitting chip packages 130 , wherein the first heat dissipation plate 110 has an upper surface 110 a and a lower surface 110 b. The partition wall 120 is disposed on the upper surface 110a of the first heat dissipation plate 110 to form a plurality of grooves 110c, and the partition wall 120 has a plurality of first contacts 120a. In this embodiment, the first heat dissipation plate 110 and the partition wall 120 are independent components, and the first heat dissipation plate 110 and the partition wall 120 are assembled together to form the groove 110c. However, in other embod...

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Abstract

The invention discloses a light source component, which includes a heat dissipation plate, a partition wall and a plurality of light-emitting chip packages, wherein the heat dissipation plate has an upper surface and a lower surface. The partition wall is configured on the upper surface of the heat dissipation plate to form a plurality of grooves, and the partition wall has a plurality of first contacts. These light-emitting chip packages are pluggably configured in the groove, and each light-emitting chip package has a plurality of second contacts. When the light-emitting chip packages are disposed in the groove, each second contact is in contact with one of the first contacts to be electrically connected. Therefore, such light source components are easier to rework or assemble.

Description

technical field [0001] The present invention relates to a light source assembly, and in particular to a light source assembly using a light-emitting chip package. Background technique [0002] In recent years, light emitting diode (LED) devices using gallium nitride-containing compound semiconductors, such as gallium nitride (GaN), aluminum gallium nitride (AlGaN), indium gallium nitride (InGaN), etc., have attracted much attention. . Group III nitrides are materials with a wide band energy gap, and their emission wavelengths can cover from ultraviolet light to red light, so it can be said to almost cover the entire visible light band. In addition, compared with traditional light bulbs, light-emitting diodes have absolute advantages, such as small size, long life, low voltage / current drive, not easy to break, mercury-free (no pollution problem), and good luminous efficiency (power saving), etc., Therefore, light-emitting diodes are widely used in industry. [0003] Since ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V29/00F21V23/00H01L25/00H01L25/075H01L33/00F21Y101/02F21V29/70F21Y115/10F21Y115/15H01L33/48H01L33/64
CPCH01L2224/48091H01L2224/48472H01L2224/73265
Inventor 潘玉堂周世文
Owner CHIPMOS TECH INC
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