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Internally burying type chip packaging manufacture process and circuit board having the same

A chip packaging and circuit substrate technology, applied in the direction of printed circuits, circuits, and electrical components connected to non-printed electrical components, can solve problems such as yield reduction and accuracy shift, and achieve the effect of improving yield

Active Publication Date: 2009-07-15
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, using a laser to form the conductive hole 122 is likely to cause alignment deviation and lower yield.

Method used

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  • Internally burying type chip packaging manufacture process and circuit board having the same
  • Internally burying type chip packaging manufacture process and circuit board having the same
  • Internally burying type chip packaging manufacture process and circuit board having the same

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Experimental program
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Embodiment Construction

[0037] Figure 2A ~ Figure 2G A schematic flow chart of the embedded chip packaging process according to an embodiment of the present invention is shown respectively, wherein Figure 2A ~ Figure 2E It shows the steps of disposing chips on a carrier board in the way of flip-chip bonding, and Figure 2F ~ Figure 2G The steps of embedding the chip in a dielectric material and pressing into shape are shown. Although this embodiment takes the packaging process of a single chip as an example, the present invention can also be applied to the packaging process of multiple chips, and then cut into a package structure with a single chip or multiple chips.

[0038] Please refer to Figure 2A ~ Figure 2B Firstly, a carrier 200 and a metal sheet 210 are provided, and the metal sheet 210 is patterned to form the first circuit layer 212 . Wherein, the carrier 200 is, for example, a strong and supportive metal plate or an insulating plate, but it can also be a soft film or film for carryin...

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PUM

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Abstract

This invention relates to a packaging process for built-in chips and a circuit base board with the built-in chip, in which, the packaging process includes: connecting a chip to a first circuit layer on a loading plate then to be pressed onto a dielectric material by a stitching lamination plate so as to bury the chip in the dielectric material and form a circuit base board with a built-in chip, which includes at least one convex block connected with a joint pad of the first circuit layer by solder. This invention can replace a current method of pore-forming with laser and processing circuit since the cover crystal jointing process can provide better reliability of joint and accuracy of contraposition.

Description

technical field [0001] The present invention relates to a chip packaging process and its structure, and in particular to an embedded chip packaging process and a circuit substrate with embedded chips. Background technique [0002] In recent years, with the rapid development of electronic technology and the emergence of high-tech electronic industries, electronic products with more humanization and better functions are constantly being introduced, and are designed towards the trend of light, thin, short and small. A circuit substrate is usually arranged in these electronic products, and the circuit substrate is used to carry a single chip or multiple chips as a data processing unit of the electronic product. The chip is embedded in the circuit substrate, which has become the key technology at present. [0003] figure 1 It is a cross-sectional view of an existing circuit substrate with embedded chips, please refer to figure 1 , the circuit substrate 10 includes a substrate ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H05K1/18
CPCH01L2224/10
Inventor 郑振华
Owner UNIMICRON TECH CORP