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Method for forming through-hole that utilizes lazer drill

A technology of laser drilling and vias, which is applied to the removal of conductive materials by chemical/electrolytic methods, the processing of insulating substrates/layers, and electrical components. It can solve the problems of long processing time, increased processing difficulty, and via-hole Surface unevenness and other problems, to achieve the effect of shortening the processing time, ensuring uniformity, and reducing the phenomenon of electroplating defects

Inactive Publication Date: 2009-07-22
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] However, when laser drilling is used to form via holes, the copper clad laminate using the above-mentioned prepreg needs to be processed while burning glass fibers compared with the existing RCC products without compensating materials, which increases the processing cost. Difficulty, and there is a problem of long processing time
[0015] In addition, due to processing while burning glass fiber, the side surface of the formed via hole is not uniform, resulting in poor plating problems

Method used

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  • Method for forming through-hole that utilizes lazer drill
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  • Method for forming through-hole that utilizes lazer drill

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Embodiment Construction

[0024] Preferred embodiments of the present invention will be specifically described below with reference to the accompanying drawings.

[0025] Figure 2A to Figure 2J It is a flow chart of a via hole forming method using a laser drilling machine according to an embodiment of the present invention.

[0026] First, if Figure 2A As shown, a first circuit board 200 in which circuits 202 are formed on both surfaces of an insulating layer 201 is prepared. In this case, any of prepreg or resin may be used for the insulating layer 201 , and common electrolytic copper foil is used for the circuit 202 .

[0027] Secondly, if Figure 2B As shown, a plurality of prepregs 210 drilled with holes are prepared by mechanical drilling at locations where via holes 211 are to be formed. The above-mentioned prepreg 210 is a sheet-shaped raw material (refer to image 3 ), used as the basic raw material of copper foil laminates and the interlayer adhesive of multilayer PCB.

[0028] At this...

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Abstract

A method for forming a via hole using a laser drill is provided to reduce plating defects through uniformization of the shape of hole by previously removing a glass fiber of prepreg with a mechanical drill and forming the via hole in a resin filled in a part where the glass fiber is removed by the laser drill. A method for forming a via hole using a laser drill includes the steps of: preparing a first circuit substrate(200) having circuits(202) on both surfaces of an insulation layer(201); preparing a plurality of prepregs(210) having via hole points punched through mechanical drilling; stacking the prepregs(210) on both surfaces where the circuits(202) of the first substrate(200) are formed; and fabricating the via hole with a laser drill at the via hole points filled with resin by flowing down the resin of the prepregs(210) at the above step.

Description

technical field [0001] The present invention relates to a method of forming a via hole using a laser drilling machine. More specifically, the present invention relates to a method of laminating a plurality of prepregs on both sides of a circuit substrate circuit, and then, using a laser Drilling machine A method in which a plurality of prepregs are mechanically drilled at the position where the via hole is to be formed by processing the position of the via hole that is filled with the resin flowing from the prepreg during lamination to form a via hole And drill holes. Background technique [0002] In recent years, with the rapid digitalization and networking of the electronics industry, electronic equipment has been required to achieve miniaturization, light weight, thinner shape, and higher performance. As a result, electronic equipment components have also achieved high integration and ultra-thin reduction. [0003] Therefore, a printed circuit board on which highly integ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06H05K3/00
CPCH05K3/0026H05K3/0044H05K3/0055H05K3/181
Inventor 金癸洙金载国李先镐俞贤珍
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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