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Heat pipe device for electronic refrigerator and making method thereof

A technology for electronic refrigerators and heat pipe devices, which is applied to the operation mode of machines, machines using electric/magnetic effects, refrigerators, etc., can solve the problem of uneven wall thickness of the cavity, unsatisfactory heat transfer efficiency, and unsatisfactory users. and other problems, to achieve the effect of good heat exchange efficiency, convenient and sufficient condensation, simple and reasonable structure

Active Publication Date: 2009-07-29
GUANGDONG XINBAO ELECTRICAL APPLIANCES HLDG CO LTD
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  • Summary
  • Abstract
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AI Technical Summary

Problems solved by technology

[0002] The heat pipe of a common electronic refrigerator is attached to the hot end of the refrigerating semiconductor through a liquid storage chamber. Drawing out the cavity, this kind of manufacturing process and structure is relatively simple, but the yield is relatively low, and the wall thickness of the drawn cavity is different, the heat transfer efficiency is not ideal, and the quality is not easy to control, which makes users Not so satisfied

Method used

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  • Heat pipe device for electronic refrigerator and making method thereof
  • Heat pipe device for electronic refrigerator and making method thereof
  • Heat pipe device for electronic refrigerator and making method thereof

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Embodiment Construction

[0027] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0028] see Figure 1-Figure 6 , the heat pipe device of the electronic refrigerator includes a heat pipe arranged at the hot end of the refrigeration semiconductor, and fins are arranged on the heat pipe, and the heat pipe includes an evaporation pipe 1 for evaporating the refrigerant and a condensation pipe 2 for condensing the refrigerant, and the heat pipe passes through A prefabricated liquid storage chamber is connected to the hot end of the refrigeration semiconductor. The liquid storage chamber includes two left and right columnar chambers. The evaporation pipe 1 and the condensation pipe 2 are respectively connected to the upper parts of the two chambers. The two chambers pass through The communication pipe 5 communicates with each other, and the communication pipe 5 is located at the middle and lower parts of the two chambers, and the diameter ...

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Abstract

A heat pipe device for an electronic refrigerator, comprising a heat pipe arranged at the hot end of a refrigeration semiconductor, fins are arranged on the heat pipe, and the heat pipe includes an evaporation pipe for evaporating the refrigerant and a condenser pipe for condensation of the refrigerant. The heat pipe passes through a prefabricated The liquid storage chamber is connected to the hot end of the refrigeration semiconductor, and the liquid storage chamber includes two left and right chambers, the evaporation pipe and the condensation pipe are respectively connected to the two chambers, and the two chambers are connected through a communication pipe. A heat conduction outer wall is arranged on the outside of the liquid storage chamber, and the heat conduction outer wall is attached to the semiconductor hot end. In the present invention, the inclination angle of the evaporating tube located in the front section is larger than that of the condensing tube, so as to ensure that the gaseous refrigerant can quickly dissipate heat to the outside, and during the condensation process, the flow of the liquid refrigerant is relatively slow, which is convenient for full condensation , to make sufficient preparations for the next effective cycle. The invention has the advantages of simple and reasonable structure, high production efficiency, stable quality and good heat exchange efficiency.

Description

technical field [0001] The invention relates to a heat pipe device of an electronic refrigerator and a manufacturing method thereof. Background technique [0002] The heat pipe of a common electronic refrigerator is attached to the hot end of the refrigerating semiconductor through a liquid storage chamber. Drawing out the cavity, this kind of manufacturing process and structure is relatively simple, but the yield is relatively low, and the wall thickness of the drawn cavity is different, the heat transfer efficiency is not ideal, and the quality is not easy to control, which makes users Not so satisfied. Contents of the invention [0003] The object of the present invention is to provide a heat pipe device for an electronic refrigerator with simple and reasonable structure, high production efficiency, low production cost, stable quality and high heat exchange efficiency, so as to overcome the shortcomings in the prior art. [0004] A heat pipe device for an electronic r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B21/02F28D15/02
Inventor 郭建刚潘卫东
Owner GUANGDONG XINBAO ELECTRICAL APPLIANCES HLDG CO LTD
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